Patents by Inventor Sheng-Yao Lin

Sheng-Yao Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154021
    Abstract: A p-GaN high-electron-mobility transistor (HEMT) includes a buffer layer stacked on a substrate, a channel layer stacked on the buffer layer, a supply layer stacked on the channel layer, a doped layer stacked on the supply layer, and a hydrogen barrier layer covering the supply layer and the doped layer. A source and a drain are electrically connected to the channel layer and the supply layer, respectively. A gate is located on the doped layer. The hydrogen barrier layer is doped with fluorine.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 9, 2024
    Inventors: TING-CHANG CHANG, Wei-Chen Huang, Shih-Kai Lin, Yong-Ci Zhang, Sheng-Yao Chou, Chung-Wei Wu, Po-Hsun Chen
  • Patent number: 11964520
    Abstract: A packaging method for a tire pressure monitoring sensor includes a step of placing, a step of pouring, and a step of hardening. In the step of placing, a sensing transmission module is put into a cavity of a modeling unit, and a positioning portion in the cavity restricts the sensing transmission module from moving transversely and toward an inner bottom of the cavity. In the step of pouring, a rubber compound is poured into the cavity and fills the cavity. The sensing transmission module is coated by the rubber compound to form a case on the outer surface of the sensing transmission module. In the step of hardening, the case is hardened and integrally formed with the sensing transmission module to form a tire pressure monitoring sensor which is removed from the cavity.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: April 23, 2024
    Assignee: SYSGRATION LTD.
    Inventors: Sheng-Hao Lee, Shih-Yao Lin
  • Patent number: 11567745
    Abstract: A compiler includes a front-end module, an optimization module, and a back-end module. The front-end module pre-processes a source code to generate an intermediate code. The optimization module optimizes the intermediate code. The back-end module translates the optimized intermediate code to generate a machine code. Optimization includes translating a branch instruction in the intermediate code into performing the following operations: establishing a post dominator tree for the branch instruction to find an immediate post dominator of the branch instruction as a reconverge point of a first path and a second path of the branch instruction; inserting a specific instruction at the front end of the reconverge point, so as to jumping to execute the instructions of the second path on the condition that once the specific instruction on the first path is executed.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: January 31, 2023
    Inventors: Chung-ho Chen, Dun-jie Chen, Feng-ming Hsu, Sheng-yao Lin
  • Publication number: 20220206768
    Abstract: A compiler includes a front-end module, an optimization module, and a back-end module. The front-end module pre-processes a source code to generate an intermediate code. The optimization module optimizes the intermediate code. The back-end module translates the optimized intermediate code to generate a machine code. Optimization includes translating a branch instruction in the intermediate code into performing the following operations: establishing a post dominator tree for the branch instruction to find an immediate post dominator of the branch instruction as a reconverge point of a first path and a second path of the branch instruction; inserting a specific instruction at the front end of the reconverge point, so as to jumping to execute the instructions of the second path on the condition that once the specific instruction on the first path is executed.
    Type: Application
    Filed: March 29, 2021
    Publication date: June 30, 2022
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chung-ho Chen, Dun-jie Chen, Feng-ming Hsu, Sheng-yao Lin
  • Patent number: 8858615
    Abstract: A novel cardiovascular stent for preventing vascular stenosis is disclosed. The basic components of the cardiovascular stent of the present invention include V-shape rib unit, multi-link unit and connective ring unit. In addition, each ring rib part is formed by a plurality of double V-shape rib units that are connected together via the bridging portions of the multi-link units. Also, each connective part comprises a plurality of connective ring units. The integrally formed stent of the present invention is formed with the ring rib parts that are connected together by the connective parts.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: October 14, 2014
    Assignees: National Taiwan University, National Taipei University of Technology
    Inventors: Cheng-Shun Chen, Yih-Sharng Chen, Nai-Kuan Chou, Hsi-Yu Yu, Sheng-Yao Lin
  • Publication number: 20110288631
    Abstract: A novel cardiovascular stent for preventing vascular stenosis is disclosed. The basic components of the cardiovascular stent of the present invention include V-shape rib unit, multi-link unit and connective ring unit. In addition, each ring rib part is formed by a plurality of double V-shape rib units that are connected together via the bridging portions of the multi-link units. Also, each connective part comprises a plurality of connective ring units. The integrally formed stent of the present invention is formed with the ring rib parts that are connected together by the connective parts.
    Type: Application
    Filed: May 19, 2010
    Publication date: November 24, 2011
    Applicants: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY, NATIONAL TAIWAN UNIVERSITY
    Inventors: Cheng-Shun Chen, Yih-Sharng Chen, Nai-Kuan Chou, Hsi-Yu Yu, Sheng-Yao Lin
  • Publication number: 20090107527
    Abstract: A method of cleaning a transparent device in a thermal process apparatus, wherein the transparent device is disposed in a chamber of a thermal process apparatus, and the transparent device includes a wafer holder for carry a wafer disposed under the transparent device, and an energy source output device disposed above the transparent device in the chamber, is provided. The method of the present invention includes performing a surface treatment step to clean a surface of the transparent device.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Yung Wang, Shin-Long Wu, Chao-Hu Liang, Sheng-Yao Lin, Hui-Shen Shih, Yu-Fang Chien