Patents by Inventor Sheng-Yao Wu

Sheng-Yao Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT
    Publication number: 20230131821
    Abstract: A heat dissipation structure, includes: a lead frame, including a high temperature pad and a low temperature pad, the high temperature pad and the low temperature pad being two portions in the lead frame which are separated from each other, wherein a high heat generation component is disposed on the high temperature pad; and a high thermal conduction element, including two sides which are respectively directly connected with the high temperature pad and the low temperature pad, to dissipate the heat energy from the high heat generation component to the low temperature pad.
    Type: Application
    Filed: July 6, 2022
    Publication date: April 27, 2023
    Inventors: Heng-Chi Huang, Sheng-Yao Wu, Chi-Yung Wu, Yong-Zhong Hu