Patents by Inventor Sheng-Yu Chen
Sheng-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250076245Abstract: A method and system for establishing a model for sensing ions in a solution, and a method and system for sensing ions in a solution apply an ion-sensitive field effect transistor in a machine learning model for ion detection in training solutions. The method for establishing a model includes adjusting environmental parameters, where the environmental parameters are selected from any one of multiple target temperatures or from any one of multiple external electric fields; establishing at least one virtual sensor based on the biasing relationship of the multi-gate ion sensitive field effect transistor; obtaining, by the at least one virtual sensor, multiple training features of the training solution based on the environmental parameters and bias parameters; and loading, by a computer, the environmental parameters and the training features into a machine learning model to establish an ion detection model, which is used to sense the types and concentrations of ions.Type: ApplicationFiled: November 9, 2023Publication date: March 6, 2025Inventors: Chih-Ting Lin, Yi-Ting Wu, Sheng-Yu Chen, Wei-En Hsu
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Patent number: 12089349Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: August 29, 2023Date of Patent: September 10, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Patent number: 11997888Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: GrantFiled: December 13, 2021Date of Patent: May 28, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Patent number: 11942385Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: GrantFiled: March 29, 2022Date of Patent: March 26, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
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Publication number: 20230413454Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: August 29, 2023Publication date: December 21, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Patent number: 11744024Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: January 11, 2022Date of Patent: August 29, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Publication number: 20230005970Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.Type: ApplicationFiled: September 6, 2022Publication date: January 5, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Patent number: 11437415Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.Type: GrantFiled: August 30, 2019Date of Patent: September 6, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I. Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Publication number: 20220223489Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sheng-Yu CHEN, Chang-Lin YEH, Ming-Hung CHEN
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Publication number: 20220141971Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: January 11, 2022Publication date: May 5, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20220102453Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: ApplicationFiled: December 13, 2021Publication date: March 31, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH
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Patent number: 11289394Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: GrantFiled: December 23, 2019Date of Patent: March 29, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
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Patent number: 11224132Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: September 6, 2019Date of Patent: January 11, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I. Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Patent number: 11201200Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: GrantFiled: August 23, 2019Date of Patent: December 14, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Patent number: 11081473Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.Type: GrantFiled: August 23, 2019Date of Patent: August 3, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Publication number: 20210193545Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: ApplicationFiled: December 23, 2019Publication date: June 24, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sheng-Yu CHEN, Chang-Lin YEH, Ming-Hung CHEN
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Publication number: 20210076510Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: September 6, 2019Publication date: March 11, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20210066354Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.Type: ApplicationFiled: August 30, 2019Publication date: March 4, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20210057572Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: ApplicationFiled: August 23, 2019Publication date: February 25, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH
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Publication number: 20210057398Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.Type: ApplicationFiled: August 23, 2019Publication date: February 25, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH