Patents by Inventor Sheng-Yu YAN

Sheng-Yu YAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafers having a die region and a scribe-line region adjacent to the die region
    Patent number: 9865516
    Abstract: A wafer and a forming method thereof are provided. The wafer has a die region and a scribe-line region adjacent to the die region, and includes a conductive bonding pad in the die region of the wafer and a wafer acceptance test (WAT) pad in the scribe-line region of the wafer. A top surface of the WAT pad is lower than a top surface of the conductive bonding pad.
    Type: Grant
    Filed: January 10, 2016
    Date of Patent: January 9, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Tzung-Han Lee, Chun-Yi Wu, Sheng-Yu Yan, Yi-Ting Cheng
  • WATERS HAVING A DIE REGION AND A SCRIBE-LINE REGION ADJACENT TO THE DIE REGION
    Publication number: 20170200661
    Abstract: A wafer and a forming method thereof are provided. The wafer has a die region and a scribe-line region adjacent to the die region, and includes a conductive bonding pad in the die region of the wafer and a wafer acceptance test (WAT) pad in the scribe-line region of the wafer. A top surface of the WAT pad is lower than a top surface of the conductive bonding pad.
    Type: Application
    Filed: January 10, 2016
    Publication date: July 13, 2017
    Inventors: Tzung-Han LEE, Chun-Yi WU, Sheng-Yu YAN, Yi-Ting CHENG