Patents by Inventor Sheng-Yuah He

Sheng-Yuah He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier and method for fabricating coreless packaging substrate
    Patent number: 9485863
    Abstract: A fabrication method of a coreless packaging substrate is provided, including the steps of: forming an inner built-up circuit board on a carrier; removing the carrier; and symmetrically forming a first outer built-up structure and a second outer built-up structure on top and bottom surfaces of the inner built-up circuit board, respectively. The present invention effectively increases the product yield, saves the fabrication cost, and reduces wastes.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: November 1, 2016
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Chung W. Ho, Dyi-Chung Hu, Huan-Ling Lee, Sheng-Yuah He
  • CARRIER AND METHOD FOR FABRICATING CORELESS PACKAGING SUBSTRATE
    Publication number: 20130335928
    Abstract: A fabrication method of a coreless packaging substrate is provided, including the steps of: forming an inner built-up circuit board on a carrier; removing the carrier; and symmetrically forming a first outer built-up structure and a second outer built-up structure on top and bottom surfaces of the inner built-up circuit board, respectively. The present invention effectively increases the product yield, saves the fabrication cost, and reduces wastes.
    Type: Application
    Filed: February 28, 2013
    Publication date: December 19, 2013
    Applicant: UNIMICRON TECHNOLOGY CORPORATION
    Inventors: Tzyy-Jang Tseng, Chung W. Ho, Dyi-Chung Hu, Huan-Ling Lee, Sheng-Yuah He