Abstract: An integrated circuit includes a first power rail and a second power rail extending in a first direction, and a first power grid stub connected to the first power rail through a first via-connector. The integrated circuit also includes a first vertical conducting line extending in a second direction in a circuit cell between a first vertical cell boundary and a second vertical cell boundary. The first vertical conducting line and the first power grid stub are in a same metal layer and aligned with each other along the second direction.

Abstract: A power semiconductor device includes a substrate, a main body, and an electrode unit. The main body includes an active portion disposed on the substrate, an edge termination portion, and an insulating layer disposed on the edge termination portion. The edge termination portion includes first-type semiconductor region, a second-type semiconductor region and a top surface. The first-type semiconductor region is adjacent to the active portion and has a first-type doping concentration decreased from the top surface toward the substrate. The electrode unit includes a first electrode disposed on the insulating layer, and a second electrode disposed on the substrate.

Abstract: A power semiconductor device includes a substrate, a main body, and an electrode unit. The main body includes an active portion disposed on the substrate, an edge termination portion, and an insulating layer disposed on the edge termination portion. The edge termination portion includes first-type semiconductor region, a second-type semiconductor region and a top surface. The first-type semiconductor region is adjacent to the active portion and has a first-type doping concentration decreased from the top surface toward the substrate. The electrode unit includes a first electrode disposed on the insulating layer, and a second electrode disposed on the substrate.