Abstract: An interconnection structure used for sequentially bonding at least two cell slices and forming an excellent electrical connection. At least one of a front electrode and a back electrode of the cell slice is in a hollow structure, and the back electrode of the previous back electrode is connected with the front electrode of the next cell slice adjacent thereto through a conductive adhesive, thereby saving a large amount of front and back electrode paste, and reducing the cost of the shingled cell.

Abstract: Embodiments relate to creating a backup configuration page for a modem. The backup configuration page can be accessed while the modem is experiencing a service problem to facilitate restoring the configuration settings of the modem to those associated with the backup configuration page. In some embodiments, a configuration diagnostic test can be performed before saving the configuration settings as the backup configuration page so as to assure a user that the configuration settings of the backup configuration page do not or will not create a service problem.

Abstract: A shingled photovoltaic module with bypass diodes, includes four regions. Each region includes a plurality of cell strings consisting of crystalline silicon cells or crystalline silicon slice cells; the cell strings in the each region are connected in parallel with each other, and circuits between the regions are connected in series with each other; a first region and a second region are protected by one bypass diode, and a third region and a fourth region are protected by another bypass diode; the bypass diodes are positioned in a central part of the module; and positive electrode and negative electrode cables of the module are led out from a junction box which is located on a back side of the module and is close to an edge of the module.

Abstract: A shingled photovoltaic module with bypass diodes, includes four regions. Each region includes a plurality of cell strings consisting of crystalline silicon cells or crystalline silicon slice cells; the cell strings in the each region are connected in parallel with each other, and circuits between the regions are connected in series with each other; a first region and a second region are protected by one bypass diode, and a third region and a fourth region are protected by another bypass diode; the bypass diodes are positioned in a central part of the module; and positive electrode and negative electrode cables of the module are led out from a junction box which is located on a back side of the module and is close to an edge of the module.

Abstract: An interconnection structure used for sequentially bonding at least two cell slices and forming an excellent electrical connection. At least one of a front electrode and a back electrode of the cell slice is in a hollow structure, and the back electrode of the previous back electrode is connected with the front electrode of the next cell slice adjacent thereto through a conductive adhesive, thereby saving a large amount of front and back electrode paste, and reducing the cost of the shingled cell.