Patents by Inventor Shengcheng JIN

Shengcheng JIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROCESSING REFERENCE DATA FOR WAFER INSPECTION
    Publication number: 20230139085
    Abstract: An improved apparatus and method for facilitating inspection of a wafer are disclosed. An improved method for facilitating inspection of a wafer comprises identifying a plurality of repeating patterns from reference image data associated with a layout design of the wafer. The method also comprises determining a pattern feature of one of the identified plurality of repeating patterns based on a change of a first characteristic of the reference image data. The method further comprises causing a first area of the wafer corresponding to the determined pattern feature to be evaluated.
    Type: Application
    Filed: April 6, 2021
    Publication date: May 4, 2023
    Applicant: ASML Netherlands B.V.
    Inventors: Shengcheng JIN, Haili ZHANG, Zhichao CHEN
  • Defect pattern grouping method and system
    Patent number: 11238579
    Abstract: A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: February 1, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Wei Fang, Haili Zhang, Zhichao Chen, Shengcheng Jin
  • DEFECT PATTERN GROUPING METHOD AND SYSTEM
    Publication number: 20190333205
    Abstract: A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.
    Type: Application
    Filed: January 18, 2018
    Publication date: October 31, 2019
    Inventors: Wei FANG, Haili ZHANG, Zhichao CHEN, Shengcheng JIN