Patents by Inventor Shengcheng XIA
Shengcheng XIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12387866Abstract: An inductor with the special-shaped structure includes an inductor main body and a pair of supporting legs fixed below the inductor main body, wherein the pair of supporting legs is conductors and is electrically connected to a pair of electrodes of the inductor main body, and the pair of supporting legs is configured to support the inductor main body during installation, so that a gap space is left below the inductor main body. Due to the unique structural design of the inductor in the present invention, the utilization ratio of the area of the PCB can be effectively increased, and the inductor is particularly suitable for very-high-density component installation on the PCB during power application. Moreover, by changing relative positions of the supporting legs, lower cavities with different sizes may be formed below the inductor main body, thereby facilitating optimal design for meeting different demands.Type: GrantFiled: March 29, 2022Date of Patent: August 12, 2025Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Hai Guo, Shengcheng Xia, Qintian Hou
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Patent number: 12224106Abstract: An inductive component comprises a hollow coil wound by Litz wire, a magnetic plastic packaging layer covering the coil, and a first electrode and a second electrode of the coil. The first electrode and the second electrode are exposed outside the magnetic plastic packaging layer. A manufacturing method for the inductive component comprises: winding a hollow coil by using Litz wire; connecting two leading-out terminals of the coil to portions of a leadframe to be formed into two electrodes; manufacturing a formed magnetic plastic packaging layer on the periphery of the coil; curing the magnetic plastic packaging layer through heat treatment; and carrying out leadframe cutting on the cured semi-finished product to form the two electrodes exposed outside the magnetic plastic packaging layer, and bending the two electrodes to flatly extend to the surface of the magnetic plastic packaging layer.Type: GrantFiled: March 24, 2021Date of Patent: February 11, 2025Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Yingying Wang, Xinshu Yu, Shengcheng Xia, Youyun Li
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Publication number: 20240412920Abstract: A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.Type: ApplicationFiled: August 22, 2024Publication date: December 12, 2024Applicant: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Shengcheng XIA, Xinshu YU, Youyun LI, Xin CHE
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Patent number: 12148564Abstract: A manufacturing method of an integrally formed inductor, comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides a manufacturing method of an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability.Type: GrantFiled: May 18, 2021Date of Patent: November 19, 2024Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Xinshu Yu, Youyun Li, Shengcheng Xia, Zehong Yao, Yupeng Hong, Yingying Wang, Qiang Su, Wanhe Yi, Xin Che
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Patent number: 12100543Abstract: A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55 T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.Type: GrantFiled: April 23, 2021Date of Patent: September 24, 2024Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Yingying Wang, Xinshu Yu, Shengcheng Xia, Youyun Li, Xin Che
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Patent number: 12040120Abstract: A preparation method for an inductance component, comprising: prefabricating a continuous coil row containing a plurality of hollow coils with the connections of every two adjacent hollow coils being bent feet; placing the continuous coil row into a cavity of a prefabricated mold, the cavity comprising a plurality of sub-chambers and one sub-chamber being used for placing a hollow coil; injecting the prepared soft-magnetic magnetic glue into the cavity to enable the soft-magnetic magnetic glue to coat the hollow coil, and simultaneously exposing the bent feet to the outside to perform magnet forming; cutting the formed semi-finished product; and peeling the exposed bent foot copper wire, and performing metallization to form an electrode to obtain a finished product of the inductance component. The invention has high inductance preparation efficiency, and the obtained product electrode has no risks of a dry joint, poor contact, and the like.Type: GrantFiled: March 24, 2021Date of Patent: July 16, 2024Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Qiang Su, Xinshu Yu, Shengcheng Xia, Youyun Li
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Patent number: 11854735Abstract: A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.Type: GrantFiled: March 14, 2021Date of Patent: December 26, 2023Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Qiang Su, Youyun Li, Shengcheng Xia, Xinshu Yu
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Patent number: 11701805Abstract: Disclosed are a transfer-molded inductor and a manufacturing method thereof. The inductor comprises a magnet formed by transfer molding with a soft magnetic colloid; and a prefabricated coil assembly comprising an air-core coil and electrode sheets connected at two ends of the air-core coil. The method comprises steps of: connecting a prefabricated air-core coil and an electrode sheet by welding to form a coil assembly, and placing the coil assembly in a cavity of a mold; performing transfer molding with a soft magnetic colloid in a gelatinous state so that the coil is entirely buried in the colloid while the electrode sheets at two ends of the air-core coil are at least partially exposed outside the colloid to serve as terminal electrodes; and performing demolding after the colloid is cured to form a magnet, and finishing the terminal electrodes to obtain the inductor.Type: GrantFiled: June 17, 2019Date of Patent: July 18, 2023Assignee: Shenzhen Sundlord Electronics Co., Ltd.Inventors: Xinshu Yu, Shengcheng Xia
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Publication number: 20230215612Abstract: Disclosed is a nonlinear inductor, a manufacturing method thereof, and a nonlinear inductor row. The nonlinear inductor includes two magnetic core assemblies, a conductor and a magnetic plastic encapsulation layer; the magnetic core assemblies include magnetic cores; each magnetic core includes a flange and a central column arranged on the flange; two central columns of the two magnetic core assemblies are opposite to each other; a non-uniform air gap exists between the two central columns and/or the magnetic core assemblies are made of different materials; the conductor is arranged on the two central columns; the two magnetic core assemblies and the conductor are located in the magnetic plastic encapsulation layer; electrode parts of the conductor are exposed outside the magnetic plastic encapsulation layer; and the magnetic core assemblies and the magnetic plastic encapsulation layer are made of different materials; thereby the nonlinear inductor has stepped saturation characteristics.Type: ApplicationFiled: April 6, 2022Publication date: July 6, 2023Applicant: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Hai GUO, Shengcheng XIA, Qintian HOU
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Patent number: 11685980Abstract: A preparation method for a metal soft magnetic composite material inductor includes: smelting Fe, Si and Cr and then employing a water atomization or gas atomization means to fabricate an alloy powder; after sifting by particle size, mixing powders of different particle size levels and performing coating insulation, and performing post-granulation to obtain a metal soft composite material granulation powder; adopting the granulation powder to press a material cake, and transferring and molding same; adopting a hollow coil in a liquid-phase coating mold cavity, curing and demolding to obtain a semi-finished product, then continuously heating and curing the semi-finished product, and preparing an end electrode to obtain a finished inductor.Type: GrantFiled: March 24, 2021Date of Patent: June 27, 2023Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Xinshu Yu, Shengcheng Xia, Youyun Li, Xin Che
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Publication number: 20220157519Abstract: An integrally formed inductor and a manufacturing method thereof, wherein the method comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability and a manufacturing method thereof.Type: ApplicationFiled: May 18, 2021Publication date: May 19, 2022Inventors: Xinshu YU, Youyun LI, Shengcheng XIA, Zehong YAO, Yupeng HONG, Yingying WANG, Qiang SU, Wanhe YI, Xin CHE
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Publication number: 20220157515Abstract: A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.Type: ApplicationFiled: March 14, 2021Publication date: May 19, 2022Inventors: Qiang SU, Youyun LI, Shengcheng XIA, Xinshu YU
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Patent number: 11309117Abstract: An inductive element includes a magnetic core, a flat coil wound on a middle column of the magnetic core, and a magnetic plastic package layer covering the magnetic core and the flat coil. Two electrodes connected to two pigtails of the flat coil are exposed outside of the magnetic plastic package layer. The flat coil is configured to enable a width direction of a flat wire of the flat coil to be perpendicular to an axial direction of the middle column of the magnetic core, and the flat wire is stacked layer by layer in the axial direction of the middle column. A manufacturing method for the inductive element is also disclosed herein. By using the wounding method of the flat coil of the inductive element, a height of a product may be reduced while obtaining a same DCR, so that the product is thinner.Type: GrantFiled: May 7, 2018Date of Patent: April 19, 2022Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Shengcheng Xia, Youyun Li, Xinshu Yu, Gengxin Xiao
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Publication number: 20210327640Abstract: An inductive component comprises a hollow coil wound by Litz wire, a magnetic plastic packaging layer covering the coil, and a first electrode and a second electrode of the coil. The first electrode and the second electrode are exposed outside the magnetic plastic packaging layer. A manufacturing method for the inductive component comprises: winding a hollow coil by using Litz wire; connecting two leading-out terminals of the coil to portions of a leadframe to be formed into two electrodes; manufacturing a formed magnetic plastic packaging layer on the periphery of the coil; curing the magnetic plastic packaging layer through heat treatment; and carrying out leadframe cutting on the cured semi-finished product to form the two electrodes exposed outside the magnetic plastic packaging layer, and bending the two electrodes to flatly extend to the surface of the magnetic plastic packaging layer.Type: ApplicationFiled: March 24, 2021Publication date: October 21, 2021Inventors: Yingying WANG, Xinshu YU, Shengcheng XIA, Youyun LI
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Publication number: 20210304956Abstract: A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.Type: ApplicationFiled: April 23, 2021Publication date: September 30, 2021Inventors: Yingying Wang, Xinshu Yu, Shengcheng Xia, Youyun Li, Xin Che
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Publication number: 20210210261Abstract: A preparation method for a metal soft magnetic composite material inductor includes: smelting Fe, Si and Cr and then employing a water atomization or gas atomization means to fabricate an alloy powder; after sifting by particle size, mixing powders of different particle size levels and performing coating insulation, and performing post-granulation to obtain a metal soft composite material granulation powder; adopting the granulation powder to press a material cake, and transferring and molding same; adopting a hollow coil in a liquid-phase coating mold cavity, curing and demolding to obtain a semi-finished product, then continuously heating and curing the semi-finished product, and preparing an end electrode to obtain a finished inductor.Type: ApplicationFiled: March 24, 2021Publication date: July 8, 2021Inventors: Xinshu YU, Shengcheng XIA, Youyun LI, Xin CHE
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Publication number: 20210210275Abstract: An inductance component and a preparation method thereof, comprising: prefabricating a continuous coil row containing a plurality of hollow coils with the connections of every two adjacent hollow coils being bent feet; placing the continuous coil row into a cavity of a prefabricated mold, the cavity comprising a plurality of sub-chambers and one sub-chamber being used for placing a hollow coil; injecting the prepared soft-magnetic magnetic glue into the cavity to enable the soft-magnetic magnetic glue to coat the hollow coil, and simultaneously exposing the bent feet to the outside to perform magnet forming; cutting the formed semi-finished product; and peeling the exposed bent foot copper wire, and performing metallization to form an electrode to obtain a finished product of the inductance component. The invention has high inductance preparation efficiency, and the obtained product electrode has no risks of a dry joint, poor contact, and the like.Type: ApplicationFiled: March 24, 2021Publication date: July 8, 2021Inventors: Qiang SU, Xinshu YU, Shengcheng XIA, Youyun LI
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Patent number: 10867748Abstract: A method for preparing a power inductor includes the following steps A to E: A: preparing a composite wire; B: winding the composite wire according to a predetermined shape and a predetermined coil quantity, so as to form coils; C: placing the coils into a mold cavity, adding metal soft magnetic powder to the mold cavity, and pressing the metal soft magnetic powder and the coils to form a base comprising the coils; D: performing sintering treatment on the base; and E: plating two terminal electrodes on two ends of the base to form the power inductor.Type: GrantFiled: January 12, 2018Date of Patent: December 15, 2020Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Shengcheng Xia, Youyun Li
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Publication number: 20200381151Abstract: An integrally-molded inductor comprises a coil having an insulation coating layer and a magnetic material integrally molded with the coil by compression molding, with electrodes, which are exposed outside the magnetic material, formed at two ends of the coil, wherein the insulation coating layer of the coil comprises a non-conductive inorganic particle component and a resin component which are uniformly mixed, the inorganic particle component and the resin component being in a ratio by weight percentage of 70%:30% to 90%:10%. According to the integrally-molded inductor and a method for manufacturing same, the pressure resistance of the integrally-molded inductor is improved, and the electrical properties and reliability of the inductor product are improved.Type: ApplicationFiled: August 20, 2020Publication date: December 3, 2020Inventors: Shengcheng XIA, Gengxin XIAO, Xinshu YU
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Patent number: 10811188Abstract: A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80° C. to 150° C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 ?m. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.Type: GrantFiled: January 9, 2018Date of Patent: October 20, 2020Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Shengcheng Xia, Youyun Li