Abstract: Weigh-in-motion sensors comprise a beam including a plate with a load-bearing surface, and a tube portion including a base wall and a cover and defining a cavity therebetween. A sensing package is disposed within the cavity and is under pre-load with the cover and the base wall. The sensing package comprises a piezoelectric element. The base wall includes an aperture extending from a mounting surface to the cavity. The aperture includes a fastener therein to secure the sensing package within the cavity. The fastener is sized having a cross-section dimension taken through a center axis of the fastener that is greater than that of a cross-section dimension of the piezoelectric element taken along the fastener center axis. In an example, the fastener has a cross-section dimension sized about 10 percent or greater in dimension than that of the respective cross-section dimension of the piezoelectric element.

Abstract: Weigh-in-motion sensors comprise a beam including a plate with a load-bearing surface, and a tube portion including a base wall and a cover and defining a cavity therebetween. A sensing package is disposed within the cavity and is under pre-load with the cover and the base wall. The sensing package comprises a piezoelectric element. The base wall includes an aperture extending from a mounting surface to the cavity. The aperture includes a fastener therein to secure the sensing package within the cavity. The fastener is sized having a cross-section dimension taken through a center axis of the fastener that is greater than that of a cross-section dimension of the piezoelectric element taken along the fastener center axis. In an example, the fastener has a cross-section dimension sized about 10 percent or greater in dimension than that of the respective cross-section dimension of the piezoelectric element.

Abstract: A load transfer mechanism includes an elongated beam and a sensing package. The beam includes a plate with a load-bearing surface, a tube portion, and a neck. The tube portion includes a base wall and a cover and defines a cavity between the base wall and the cover. The base wall laterally extends from a first edge to a second edge that is opposite the first edge. The cover is joined to the base wall at or proximate to the first and second edges. The neck extends between and joins the plate to the cover of the tube portion. The sensing package is disposed within the cavity of the beam and is under pre-load in engagement with the cover and the base wall. The sensing package is configured to measure forces exerted on the load-bearing surface of the plate.

Abstract: A head module for a large-scale container, a large-scale container having the head module, and methods for manufacturing the head module and the large-scale container. The method for manufacturing a head module comprises providing a head having an annular opening, the head being composed of a plurality of petals, providing a plurality of cylinder plates, and forming a head cylindrical ring, connecting in order the plurality of cylinder plates to the end surface of the annular opening and joining facing sides of all adjacent cylinder plates. Based on the unfitness of the petals at the annular opening of the head, gaps between adjacent cylinder plates may be adjusted, and/or the positions of the cylinder plates on the end surface of the annular opening of the head may be adjusted radially inwards or outwards.

Abstract: A load transfer mechanism includes an elongated beam and a sensing package. The beam includes a plate with a load-bearing surface, a tube portion, and a neck. The tube portion includes a base wall and a cover and defines a cavity between the base wall and the cover. The base wall laterally extends from a first edge to a second edge that is opposite the first edge. The cover is joined to the base wall at or proximate to the first and second edges. The neck extends between and joins the plate to the cover of the tube portion. The sensing package is disposed within the cavity of the beam and is under pre-load in engagement with the cover and the base wall. The sensing package is configured to measure forces exerted on the load-bearing surface of the plate.

Abstract: The invention relates to a semiconductor field, especially to a method for increasing burning speed of a system firmware. The invention adjusts the size of an intermediate file system, generates the corresponding mirror of the system according to the size of the adjusted intermediate file system, then burn the mirror of the system into the flash memory of the device. Thus the size of the mirror of the system is reduced efficiently, the time of making the mirror of the system and transmitting the mirror to the memory is saved, the time of burning the mirror of the system into the flash memory is saved, and the burning speed of the system firmware is increased efficiently.

Abstract: Techniques are disclosed for performing topologically planar routing of System in Packages (SiPs). A routing graph can be represented by a particle-insertion-based constraint Delaunay triangulation (PCDT) and its dual. A dynamic search routing may be performed using a DS* routing algorithm to determine the shortest path on the dual graph between a start point and an end point. Based on a dynamic pushing technique, net ordering problems may be solved. A first wire can be topologically routed. Dynamic search routing of a second wire may be performed. The first wire may be pushed or detoured in response to the dynamic searching routing of a second wire.