Abstract: A lubricant for a copper alloy die-casting die is mainly prepared by an inorganic nano-powder, an organic substrate material, and an organic resin material. In the present disclosure, the use of oil-based lubricants as a basis and the reduction of the content of oil in the lubricant yield improved oil selection and proportion, which cooperates with the corresponding higher proportion of inorganic powder material mixture and a more suitable spraying amount applied on the surface of the die to exert a good lubricating effect on products with complex and irregular shapes in the inner cavity of a die-casting die. At the same time, the production cost of the lubricant is low. Copper alloy die castings produced after a lubrication process have a high yield rate and smooth surfaces without casting defects.

Abstract: A substituted pyrazolo[1,5-alpyrimidin-7-amine derivative, the structure of which is represented by formula (1), or pharmaceutically acceptable salts, solvates, stereoisomers, prodrugs, drug compositions thereof. The derivative has significant CDK9-selective inhibitory activity.

Abstract: A robot control system includes a robot controller, a data transmission module, a servo drive module, a safety unit, a demonstrator, and a power module. The servo drive module is connected to the robot controller via the data transmission module and receives a movement instruction to drive a robot to move. The safety unit is connected to the robot controller and the servo drive module via the data transmission module and turns off, upon receiving an abnormal input signal or a failure signal, the servo drive module and transmits the abnormal input signal or the failure signal to the robot controller. The demonstrator receives a terminal video signal and a first control interaction signal from the robot controller, and sends a second control interaction signal to the robot controller to control operation of the robot controller. The power module is electrically connected to the robot controller and the safety unit.

Abstract: Disclosed are a die-casting die, a die-casting device and an ultra-high speed die-casting method. The die-casting die comprises a die body, the die body is arranged with a feed port, a pouring potion and a cavity portion, the pouring potion is arranged with a pouring runner communicating to the feed port, and the cavity portion is arranged with a molding cavity; the die body is arranged with a gate portion between the cavity portion and the pouring potion, the gate portion is arranged with an ingate runner communicating the molding cavity and the pouring runner, the ingate runner is a plurality of ingate runners, and each ingate runner is arranged in sequence in the width direction of a side of the gate portion facing the molding cavity; a communicating position between the ingate runner and the molding cavity is an ingate.

Abstract: A semi-solid metal in-cavity molding die includes a die body. The die body includes a male die and a female die, a cavity formed by the male die and the female die, a runner communicated with the cavity and a sprue communicated with the runner are provided inside the die body. An inner wall of the runner is provided with a plurality of guide protrusions which are arranged in a spiral track. The guide protrusions combine the inner wall of the runner to form a special-shaped pipeline for molten metal to flow through, and a cooling mechanism arranged around the runner is further provided in the die body.

Abstract: A self-cooked soybean milk machine comprises a base, a control unit, a grinding cooked device, grinding blades inside the grinding cooked device, a motor driving the grinding blades to rotate, and a preheat device. The motor and/or the grinding cooked device are/is installed on the base, with the motor electrically connected with the control unit. When the soybean material and water are blended in the grinding cooked device and is grinded into seriflux/paste, the seriflux/paste is heated and cooked by heat produced by the friction between the seriflux/paste, the grinding blades and the grinding cooked device. The design of the grinding cooked device with a high grinding and cooking efficiency allows the self-cooked soybean milk machine to reduce the pulping time and to produce the pulp in five minutes.

Abstract: A self-cooked soybean milk machine comprises a base (1), a control unit (12), a grinding cooked device (121), grinding blades (134) inside the grinding cooked device (131), a motor (135) driving the grinding blades (134) to rotate, and a preheat device. The motor (135) and/or the grinding cooked device (131) are/is installed on the base (1), with the motor electrically connected with the control unit (12). When the soybean material and water are blended in the grinding cooked device (131) and is grinded into seriflux/paste, the seriflux/paste is heated and cooked by heat produced by the friction between the seriflux/paste, the grinding blades (134) and the grinding cooked device (131). The design of the grinding cooked device with a high grinding and cooking efficiency allows the self-cooked soybean milk machine to reduce the pulping time and to produce the pulp in five minutes.

Abstract: A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

Abstract: A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

Abstract: A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body (20) defining a central chamber (21) therein and having a number of fins (22) on an outside thereof, liquid coolant received in the central chamber, a first fan (40) received in the central chamber, and a second fan (60) positioned over the main body and engaged with the first fan. The heat sink assembly couples forced liquid cooling and forced airflow cooling, and need not extra pipes to form a circuit for the liquid coolant. Thus, not only the volume of the heat sink assembly is lessened, but also facilitates matching with electronic components.

Abstract: A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

Abstract: A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body (20) defining a central chamber (21) therein and having a number of fins (22) on an outside thereof, liquid coolant received in the central chamber, a first fan (40) received in the central chamber, and a second fan (60) positioned over the main body and engaged with the first fan. The heat sink assembly couples forced liquid cooling and forced airflow cooling, and need not extra pipes to form a circuit for the liquid coolant. Thus, not only the volume of the heat sink assembly is lessened, but also facilitates matching with electronic components.

Abstract: A heat dissipation device (1) includes a heat sink (12), a number of first pipes (14), a pair of second pipes (16), and working liquid. The heat sink includes a base (122), and a number of fins (124) attached on the base. A number of parallel first holes (126) is defined through the base. A second hole (128) is defined through a middle of the base in a longitudinal direction that is perpendicular to the first holes. The first and second pipes and the first and second holes thus cooperatively form a closed circulatory route. The working liquid is received in the circulatory route. In operations the working liquid absorbs heat at the base and circulates through the circulatory route. The first and second pipes dissipate said heat to airspace beyond the fins. Accordingly, the first and second pipes increase a heat dissipation area of the heat dissipation device.

Abstract: A fan holder (10) for mounting a fan (30) to a heat sink (20) includes a rectangular base (12). The base is attached to the heat sink, and supports the fan thereon. An opening (14) is defined in the base, for providing airflow access from the fan to the heat sink. A pair of tabs (16) depends from each of opposite sides of the base. Each pair of tabs is disposed at respective opposite ends of the respective side of the base. A stop (161) integrally extends from each tab, the stop engaging in a corresponding slot of the heat sink. A handle (163) integrally extends from each tab, for facilitating manual operation whereby the tab is moved resiliently. In a preferred embodiment, each stop is orthogonal to both the tab and the base. In an alternative embodiment, each stop is orthogonal to the tab and parallel to the base.

Abstract: A fan holder (10) for mounting a fan (30) to a heat sink (20) includes a rectangular base (12). The base is attached to the heat sink, and supports the fan thereon. An opening (14) is defined in the base, for providing airflow access from the fan to the heat sink. A pair of tabs (16) depends from each of opposite sides of the base. Each pair of tabs is disposed at respective opposite ends of the respective side of the base. A stop (161) integrally extends from each tab, the stop engaging in a corresponding slot of the heat sink. A handle (163) integrally extends from each tab, for facilitating manual operation whereby the tab is moved resiliently. In a preferred embodiment, each stop is orthogonal to both the tab and the base. In an alternative embodiment, each stop is orthogonal to the tab and parallel to the base.

Abstract: A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The condensing portion receives vapor from the vaporizing portion, and cools the vapor to back to liquid form. The pipes are engaged with the vaporizing portion and the condensing portion, thus forming a circulatory route for the vapor from the vaporizing portion to the condensing portion, and for the liquid from the condensing portion to the vaporizing portion.

Abstract: A mounting assembly for securing a heat sink (10) to an electronic package (50) mounted on a circuit board (40) includes a back plate (20), a clip (30), and two screws (70). The back plate abuts an underside of the circuit board. The back plate includes a cross-shaped main body (22), and two first positioning posts (24) and two second positioning posts (26). An annular groove (242) and a threaded hole (262) are defined in each first and each second positioning post respectively. The clip includes a horizontal portion (32), and two first legs (34) and two second legs (36). A guiding hole (342) and a communicating positioning slot (344) are defined in each first leg, the positioning slot engagingly receiving a corresponding first positioning post. A fastening slot (362) is defined in each second leg. The screws are inserted through the fastening slots into the corresponding threaded holes.

Abstract: A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

Abstract: A heat dissipation device (1) includes a heat sink (12), a plurality of first pipes (14), a pair of second pipes (16), and working liquid. The heat sink includes a base (122), and a plurality of fins (124) attached on the base. A plurality of parallel first holes (126) is defined through the base. A second hole (128) is defined through a middle of the base in a longitudinal direction that is perpendicular to the first holes. The first and second pipes and the first and second holes thus cooperatively form a closed circulatory route. The working liquid is received in the circulatory route. In operation, the working liquid absorbs heat at the base and circulates through the circulatory route. The first and second pipes dissipate said heat to airspace beyond the fins. Accordingly, the first and second pipes increase a heat dissipation area of the heat dissipation device.

Abstract: A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The condensing portion receives vapor from the vaporizing portion, and cools the vapor to back to liquid form. The pipes are engaged with the vaporizing portion and the condensing portion, thus forming a circulatory route for the vapor from the vaporizing portion to the condensing portion, and for the liquid from the condensing portion to the vaporizing portion.