Abstract: A multi-molding method for fan-out stacked semiconductor package is disclosed. Two molding chambers with different sizes are provided. Multiple first packages made in front-end packaging process are placed in a first molding chamber with smaller size to form a first molding compound. After then, multiple second packages made in back-end are placed in a second molding chamber with larger size to form a second molding compound. The second molding compound encapsulates the first molding compound. Therefore, the multi-molding method of the present invention is adapted to be used in fan-out panel level package process without an expensive compression mold tape.

Abstract: An anti-fingerprint treatment reagent has an organic polydimethlysiloxane, a solvent and an additive. A surface of a metal base material is treated by the organic polydimethlysiloxane. The surface treated with the anti-fingerprint reagent is fingerprint-resistant for being hydro-oleophobic. The coating of thanti-fingerprint treatment reagent is too thin to be seen, and will not affect the optical properties and function of the surface of the base material. The anti-fingerprint treatment reagent is inexpensive, simple in treatment process, reusable and practical. Especially, the anti-fingerprint reagent fits to avoid a product surface having pollution likes water spot, sweat, fingerprint and the like.