Patents by Inventor Shengjun Ou
Shengjun Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9627807Abstract: A cable connector assembly includes a connecting frame, wherein an opening through which a cable penetrates is formed at an end of the connecting frame, a cable support connected to another end of the connecting frame and supporting the cable, a first locking part including a fixed end fixed to a first side of the connecting frame and a free end that is movable about the fixed end, a second locking part including a fixed end fixed to a second side of the connecting frame opposite to the first side of the connecting frame, and a free end that is movable about the fixed end, and a sealing portion surrounding the connecting frame and being elastic deformable.Type: GrantFiled: March 4, 2015Date of Patent: April 18, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Fei Gao, Guangxin Zhao, Jinpei Ju, Shengjun Ou, Wensheng Chen, Chunliang Chang
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Publication number: 20160268694Abstract: On-board heat dissipation can be achieved in radio frequency (RF) modules by integrating a heat sink into the RF module's antenna reflector. Said integration achieves a compact and aesthetically pleasing RF module design that reduces the overall footprint of modular active antenna systems (AASs). Embodiment antenna reflectors include portions that are perforated and/or exposed to free flowing air to provide enhanced heat dissipation capability.Type: ApplicationFiled: May 10, 2016Publication date: September 15, 2016Inventors: Zhengxiang Ma, Daniel Plaza, Shengjun Ou, Alexis Pierides, Minwei Gong
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Patent number: 9356359Abstract: On-board heat dissipation can be achieved in radio frequency (RF) modules by integrating a heat sink into the RF module's antenna reflector. Said integration achieves a compact and aesthetically pleasing RF module design that reduces the overall footprint of modular active antenna systems (AASs). Embodiment antenna reflectors include portions that are perforated and/or exposed to free flowing air to provide enhanced heat dissipation capability.Type: GrantFiled: February 23, 2013Date of Patent: May 31, 2016Assignee: Futurewei Technologies, Inc.Inventors: Zhengxiang Ma, Daniel Plaza, Shengjun Ou, Alexis Pierides, Minwei Gong
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Patent number: 9161478Abstract: Heat dissipation in vertically arrayed host device configurations can be improved through inclusion of heat sinks having split-stream fin architectures. The split-stream fin architecture includes two or more sets of angled fins separated by a central conduit, which allows for more efficient inflow and/or expulsion of convection cooling air over the heat sink. The split-stream fin arrangement may include inwardly angled fins in order to draw convection cooling air inwards from horizontal inlets, in which case warm exhaust is expelled through the central conduit. Conversely, the split-stream fin arrangement may include outwardly angled fins, which draw convection cooling air from the central conduit, and expel warm air through horizontal exhausts. The split-stream fin arrangements function well when host devices are configured horizontally, which allows for more flexible host device configurations.Type: GrantFiled: February 23, 2013Date of Patent: October 13, 2015Assignee: Futurewei Technologies, Inc.Inventors: Alexis Pierides, Minwei Gong, Daniel Plaza, Shengjun Ou
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Publication number: 20150255921Abstract: A cable connector assembly includes a connecting frame, wherein an opening through which a cable penetrates is formed at an end of the connecting frame, a cable support connected to another end of the connecting frame and supporting the cable, a first locking part including a fixed end fixed to a first side of the connecting frame and a free end that is movable about the fixed end, a second locking part including a fixed end fixed to a second side of the connecting frame opposite to the first side of the connecting frame, and a free end that is movable about the fixed end, and a sealing portion surrounding the connecting frame and being elastic deformable.Type: ApplicationFiled: March 4, 2015Publication date: September 10, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Fei GAO, Guangxin ZHAO, Jinpei JU, Shengjun OU, Wensheng CHEN, Chunliang CHANG
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Patent number: 9070960Abstract: The present invention relates to a resonator and discloses a transverse magnetic mode dielectric resonator, a transverse magnetic mode dielectric filter, and a base station. By using the present invention, good contact between contact surfaces and convenient assembly can be achieved. Moreover, the transverse magnetic mode dielectric resonator according to the embodiments of the present invention has good structure stability, convenient assembly, and strong realizability, thereby being suitable for mass production and having good mass production consistency.Type: GrantFiled: February 28, 2013Date of Patent: June 30, 2015Assignee: Huawei Technologies Co., Ltd.Inventors: Yan Mao, Lei Cai, Yuntao Zhu, Shengjun Ou
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Patent number: 8971824Abstract: A radio frequency unit and an integrated antenna are provided. The radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board. The duplexer connects to the power amplifier circuit board and the transceiver circuit board. The power amplifier circuit board connects to the transceiver circuit board. The power amplifier circuit board and the transceiver circuit board are respectively located at two end portions of the duplexer. The power amplifier circuit board and the transceiver circuit board are projected onto the same plane along a direction being vertical to the power amplifier circuit board with their projections on the same plane non-overlapped each other.Type: GrantFiled: September 13, 2011Date of Patent: March 3, 2015Assignee: Huawei Technologies Co., Ltd.Inventors: Yonghui Peng, Shengjun Ou, Tao Tang, Ganghua Yang, Tengyue Li
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Patent number: 8781409Abstract: A radio frequency unit and an integrated antenna are provided. The radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board. The duplexer connects to the power amplifier circuit board and the transceiver circuit board. The power amplifier circuit board connects to the transceiver circuit board. The power amplifier circuit board and the transceiver circuit board are respectively located at two end portions of the duplexer. The power amplifier circuit board and the transceiver circuit board are projected onto the same plane along a direction being vertical to the power amplifier circuit board with their projections on the same plane non-overlapped each other.Type: GrantFiled: November 2, 2011Date of Patent: July 15, 2014Assignee: Huawei Technologies Co., Ltd.Inventors: Yonghui Peng, Shengjun Ou, Tao Tang, Ganghua Yang, Tengyue Li
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Publication number: 20120044840Abstract: A radio frequency unit and an integrated antenna are provided. The radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board. The duplexer connects to the power amplifier circuit board and the transceiver circuit board. The power amplifier circuit board connects to the transceiver circuit board. The power amplifier circuit board and the transceiver circuit board are respectively located at two end portions of the duplexer. The power amplifier circuit board and the transceiver circuit board are projected onto the same plane along a direction being vertical to the power amplifier circuit board with their projections on the same plane non-overlapped each other.Type: ApplicationFiled: November 2, 2011Publication date: February 23, 2012Applicant: Huawei Technologies Co., Ltd.Inventors: Yonghui Peng, Shengjun Ou, Tao Tang, Ganghua Yang, Tengyue Li
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Publication number: 20120001809Abstract: A radio frequency unit and an integrated antenna are provided. The radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board. The duplexer connects to the power amplifier circuit board and the transceiver circuit board. The power amplifier circuit board connects to the transceiver circuit board. The power amplifier circuit board and the transceiver circuit board are respectively located at two end portions of the duplexer. The power amplifier circuit board and the transceiver circuit board are projected onto the same plane along a direction being vertical to the power amplifier circuit board with their projections on the same plane non-overlapped each other.Type: ApplicationFiled: September 13, 2011Publication date: January 5, 2012Applicant: Huawei Technologies Co., Ltd.Inventors: Yonghui Peng, Shengjun Ou, Tao Tang, Ganghua Yang, Tengyue Li