Abstract: A curable release coating composition contains: (A) an aliphatically unsaturated polyorganosiloxane having two or more alkenyl groups per molecule; (B) a crosslinker having two or more silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide a molar ratio of silicon-bonded hydrogen atoms to alkenyl groups in the curable release coating composition of 0.8:1 to 5:1; (C) a hydrosilylation reaction catalyst in a catalytic amount; and (D) from 0.01% to 5% by weight, based on the weight of the curable release coating composition excluding solvent if present, of particles of a cured organosiloxane composition, optionally with silica treated coating, having an average particle size of 0.5 to 30 micrometers.

Abstract: A curable composition contains: (A) a polydiorganosiloxane component including: (A1) greater than 3.1 wt % to 20 wt % of an aliphatically unsaturated polydiorganosiloxane polymer and (A3) a hydroxyl-terminated polydiorganosiloxane gum of unit formula (A-III); (B) a polyorganosilicate resin component including (B1) a capped resin, (B2) >18.53 wt % to 54.3 wt % of an uncapped resin; where the weight ratio of the uncapped resin (B2) to the capped resin (B1) is greater than 0.51 to 58.82; where component (A) and component (B) are present in amounts to provide a weight ratio of (B):(A) of 1.2:1 to less than 1.62:1; (C) a polyorganohydrogensiloxane that is present in an amount to provide a molar ratio of silicon bonded hydrogen atoms to alkenyl groups for the curable composition of 5 to 50; (D) a hydrosilylation reaction catalyst in an amount sufficient to provide 1 to 1000 ppm of platinum group metal; and (E) a condensation reaction catalyst; where the content of alkenyl groups in the curable composition is 0.

Abstract: A curable composition contains: (A) a polydiorganosiloxane component including: (A1) greater than 3.1 wt % to 20 wt % of an aliphatically unsaturated polydiorganosiloxane polymer and (A3) a hydroxyl-terminated polydiorganosiloxane gum of unit formula (A-III); (B) a polyorganosilicate resin component including (B1) a capped resin, (B2) >18.53 wt % to 54.3 wt % of an uncapped resin; where the weight ratio of the uncapped resin (B2) to the capped resin (B1) is greater than 0.51 to 58.82; where component (A) and component (B) are present in amounts to provide a weight ratio of (B):(A) of 1.2:1 to less than 1.62:1; (C) a polyorganohydrogensiloxane that is present in an amount to provide a molar ratio of silicon bonded hydrogen atoms to alkenyl groups for the curable composition of 5 to 50; (D) a hydrosilylation reaction catalyst in an amount sufficient to provide 1 to 1000 ppm of platinum group metal; and (E) a condensation reaction catalyst; where the content of alkenyl groups in the curable composition is 0.

Abstract: An (A) additive organopolysiloxane composition is disclosed, which includes (A1) a branched organopolysiloxane polymer comprising M, D and Q siloxy units, (A2) a silicone resin, and (A3) a polydiorganosiloxane oligomer. A curable composition is also disclosed, the curable composition including the (A) additive organopolysiloxane composition, (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst. A method of preparing the curable composition, and a method of forming a film with the curable composition are also disclosed. The compositions and methods are useful for forming silicone release coatings with high release force.

Abstract: An (A) additive organopolysiloxane composition is disclosed, which includes (A1) a branched organopolysiloxane polymer comprising M, D and Q siloxy units, (A2) a silicone resin, and (A3) a polydiorganosiloxane oligomer. A curable composition is also disclosed, the curable composition including the (A) additive organopolysiloxane composition, (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst. A method of preparing the curable composition, and a method of forming a film with the curable composition are also disclosed. The compositions and methods are useful for forming silicone release coatings with high release force.

Abstract: A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

Abstract: Provided is a polyorganosiloxane release coating composition, including: (A) an aryl-functional polydiorganosiloxane having a content of aliphatically unsaturated groups, (B) a polyorganosilicate resin having silicon bonded alkenyl groups, (C) a polyalkylhydrogensiloxane, having at least two silicon-bonded hydrogen atoms per a molecule, (D) a hydrosilylation reaction catalyst in a catalytic amount, (E) a hydrosilylation reaction inhibitor, (F) an anchorage additive, and optionally (G) a solvent; where the composition is free of polydiorganosiloxanes that do not have silicon bonded aryl groups, other than starting material (A). Also provided are a method for preparing a release liner(100) with a release coating(101) and the prepared release liner(100).

Abstract: Provided is a curable polyorganosiloxane release coating composition comprising: A) a branched aliphatically unsaturated polyorganosiloxane, B) a crosslinker having at least 3 silicon bonded hydrogen atoms per molecule, C) a hydrosilylation reaction catalyst, D) a hydrosilylation reaction inhibitor, and E) an aryl-functional polydiorganosiloxane having a content of aliphatically unsaturated groups. Also provided are a release liner (100) with this coating (101) and the preparation method thereof.

Abstract: A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.