Abstract: The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the assembly of the monolithic chip and the silicon-based carrier chip thereon; a conductive cover attached and electrically connected to the substrate to accommodates the assembly of the monolithic chip and the silicon-based carrier chip; and an acoustic port formed on either the conductive cover or the substrate for an external acoustic wave to reach the acoustic sensing element, wherein the monolithic silicon chip, the silicon-based carrier chip and the acoustic port are configured in such a way that the diaphragm of the acoustic sensing element can be vibrated by the external sound wave from one side thereof.

Abstract: The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the assembly of the monolithic chip and the silicon-based carrier chip thereon; a conductive cover attached and electrically connected to the substrate to accommodates the assembly of the monolithic chip and the silicon-based carrier chip; and an acoustic port formed on either the conductive cover or the substrate for an external acoustic wave to reach the acoustic sensing element, wherein the monolithic silicon chip, the silicon-based carrier chip and the acoustic port are configured in such a way that the diaphragm of the acoustic sensing element can be vibrated by the external sound wave from one side thereof.

Abstract: Disclosed is a condenser microphone chip, comprising: a substrate (21); a diaphragm (26) spaced from the substrate; a curved beam (27) connected with the diaphragm (26) to anchor the diaphragm (26) to the substrate (21); a curved beam connecting part (29) having a shape of a substantially circular plate. The curved beam (27) is arranged in the diaphragm (26). The curved beam (27) includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (29); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part (29) and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (26).

Abstract: Disclosed is a condenser microphone chip, comprising: a substrate (21); a diaphragm (26) spaced from the substrate; a curved beam (27) connected with the diaphragm (26) to anchor the diaphragm (26) to the substrate (21); a curved beam connecting part (29) having a shape of a substantially circular plate. The curved beam (27) is arranged in the diaphragm (26). The curved beam (27) includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (29); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part (29) and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (26).