Patents by Inventor Shengmao BAI

Shengmao BAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEEP ULTRAVIOLET LIGHT SOURCE AND PACKAGING METHOD THEREFOR
    Publication number: 20180248086
    Abstract: The invention discloses a deep ultraviolet light source and a packaging method thereof. The deep ultraviolet light source includes a deep ultraviolet light emitting diode chip and a lead frame, the deep ultraviolet light emitting diode chip is fixed on the lead frame, the outside of the deep ultraviolet light source is provided with a transparent protective special layer, the transparent protective special layer forms a convex structure on an top side surface of the deep ultraviolet light emitting diode chip, and the transparent protective special layer forms a recessed structure on the side surface of the deep ultraviolet light emitting diode chip.
    Type: Application
    Filed: March 17, 2016
    Publication date: August 30, 2018
    Applicant: QINGDAO JASON ELECTRIC CO., LTD.
    Inventors: Shengmao BAI, Jie WANG