Patents by Inventor Shengmin Wen
Shengmin Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250110530Abstract: A notebook computer has a conformal space that is located on the top of its main body base to hold interchangeable input modules that provide multiple types of input. An exemplary input module provides at least two different types of input, representatively typing input and handwriting input. The input module has typing input subassembly on the first side and handwriting input subassembly on the second side that is opposite to the first side. The input types may be changeable through switching sides by releasing, inverting, and putting back said input module in the conformal space that is constructed on the top of the main body base. Each input type is automatically switched on and coupled to the input/out control circuitry of the notebook computer and in a ready to use mode when the module is put into the conformal space that is on the main body base.Type: ApplicationFiled: September 27, 2024Publication date: April 3, 2025Inventor: Shengmin Wen
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Publication number: 20240411343Abstract: A notebook computer is disclosed. The notebook computer comprises a lid module, a main body base, and a power switch module. The power switch module is disposed in such a way that the user can access it when the notebook computer is in a closed position.Type: ApplicationFiled: August 16, 2024Publication date: December 12, 2024Inventor: Shengmin Wen
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Patent number: 12026971Abstract: A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.Type: GrantFiled: March 6, 2023Date of Patent: July 2, 2024Assignee: Synaptics IncorporatedInventors: Yeh-Cheng Tan, Shengmin Wen
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Publication number: 20230206683Abstract: A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.Type: ApplicationFiled: March 6, 2023Publication date: June 29, 2023Applicant: Synaptics IncorporatedInventors: Yeh-Cheng TAN, Shengmin WEN
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Patent number: 11625945Abstract: A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.Type: GrantFiled: June 23, 2020Date of Patent: April 11, 2023Assignee: Synaptics IncorporatedInventors: Yeh-Cheng Tan, Shengmin Wen
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Publication number: 20210397809Abstract: A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.Type: ApplicationFiled: June 23, 2020Publication date: December 23, 2021Inventors: Yeh-Cheng TAN, Shengmin WEN
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Publication number: 20210064090Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.Type: ApplicationFiled: August 29, 2019Publication date: March 4, 2021Inventors: Shengmin WEN, Qing XIAO, Jason GOODELLE, Joseph Kurth REYNOLDS
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Patent number: 10921855Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.Type: GrantFiled: August 29, 2019Date of Patent: February 16, 2021Assignee: Synaptics IncorporatedInventors: Shengmin Wen, Qing Xiao, Jason Goodelle, Joseph Kurth Reynolds
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Patent number: 10338754Abstract: An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outsType: GrantFiled: September 30, 2016Date of Patent: July 2, 2019Assignee: Synaptics IncorporatedInventors: Guozhong Shen, Ozan Ersan Erdogan, Shengmin Wen, Brett Dunlap
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Patent number: 10055631Abstract: A sensor package and a method of forming a sensor package are disclosed. The sensor package comprises: a multilayer substrate comprising a mold compound layer and a plurality of patterned metal layers; an embedded die embedded in the multilayer substrate, wherein the mold compound layer of the multilayer substrate surrounds the embedded die; and, a sensing element disposed over the multilayer substrate, the sensing element comprising a first patterned metal layer electrically connected to the embedded die through the multilayer substrate.Type: GrantFiled: November 3, 2016Date of Patent: August 21, 2018Assignee: Synaptics IncorporatedInventors: Shengmin Wen, Brett Dunlap, Jay Kim
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Patent number: 9785821Abstract: A capacitive sensor a method of making a capacitive sensor are disclosed. The capacitive sensor includes: a plurality of rows of sensor electrodes included in a first layer; a plurality of columns of sensor electrodes included in a second layer, where the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and, a plurality of conductive elements included in a third layer disposed between the first and second layers, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.Type: GrantFiled: December 18, 2015Date of Patent: October 10, 2017Assignee: Synaptics IncorporatedInventor: Shengmin Wen
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Publication number: 20170177113Abstract: An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outsType: ApplicationFiled: September 30, 2016Publication date: June 22, 2017Inventors: Guozhong Shen, Ozan Ersan Erdogan, Shengmin Wen, Brett Dunlap
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Publication number: 20170061187Abstract: A capacitive sensor a method of making a capacitive sensor are disclosed. The capacitive sensor includes: a plurality of rows of sensor electrodes included in a first layer; a plurality of columns of sensor electrodes included in a second layer, where the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and, a plurality of conductive elements included in a third layer disposed between the first and second layers, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.Type: ApplicationFiled: December 18, 2015Publication date: March 2, 2017Inventor: Shengmin Wen
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Publication number: 20110097699Abstract: Disclosed herein are a magnetically erasable writable educational flash card and method for making the same. The method uses a flash card comprising magnetic display panel, a magnetic die of predetermined pattern such as text character of a language, Arabic numeral, symbol or graphical picture of a learning subject, and a magnetic eraser. To make an educational flash card, a controlled repeated small amplitude sliding movement is applied to the flash card's magnetic display panel in contact with the face of the magnetic die resulting visual display of a mirrored silhouette of the magnetic die's predetermined pattern being created on the magnetic display panel. Two or more such cards comprise an educational flash card set for young children. The advantages of such flash card set include: more effective and enjoyable learning through participation, ergonomically fitful for fine motor skills development, better structured and creative learning, and changeable displaying indicia.Type: ApplicationFiled: October 24, 2009Publication date: April 28, 2011Inventor: Shengmin Wen
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Publication number: 20110065081Abstract: The invention provides an electrically erasable writable educational flash card comprising electronic display that displays prescribed patterns such as text characters of a language, Arabic numbers, and graphics pictures of a learning subject. Two or more of such cards comprise a youth oriented subject learning educational flash card set. Such card has a look of conventional paper flash card but with advantages: user can erase and write the displaying contents—making the learning activities more enjoyable and effective; the card is ergonomically fitful for young children to play with; and the card does not consume conventional paper, which is made from plant, trees in particular, and therefore conserves forest and environment. The invention further provides an electronic card writer for user to electrically erase and write the contents on the card's display. Alternatively, a commercially available computer or an electronic paper printer can be adapted as an electronic card writer.Type: ApplicationFiled: September 17, 2009Publication date: March 17, 2011Inventor: Shengmin Wen