Patents by Inventor Shengquan Ou
Shengquan Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128256Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Inventors: Robert L. SANKMAN, Sairam AGRAHARAM, Shengquan OU, Thomas J. DE BONIS, Todd SPENCER, Yang SUN, Guotao WANG
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Patent number: 11817444Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: January 28, 2022Date of Patent: November 14, 2023Assignee: Intel CorporationInventors: Robert L Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20220231007Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: April 8, 2022Publication date: July 21, 2022Inventors: Robert L. SANKMAN, Sairam AGRAHARAM, Shengquan OU, Thomas J. DE BONIS, Todd SPENCER, Yang SUN, Guotao WANG
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Patent number: 11348911Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: June 4, 2020Date of Patent: May 31, 2022Assignee: Intel CorporationInventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20220157803Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: January 28, 2022Publication date: May 19, 2022Inventors: Robert L. SANKMAN, Sairam AGRAHARAM, Shengquan OU, Thomas J DE BONIS, Todd SPENCER, Yang SUN, Guotao WANG
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Publication number: 20200395352Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: June 4, 2020Publication date: December 17, 2020Inventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Patent number: 10700051Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: June 4, 2018Date of Patent: June 30, 2020Assignee: Intel CorporationInventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20190371778Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: June 4, 2018Publication date: December 5, 2019Inventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20150001736Abstract: Die connections are described using different underfill types for different regions. In one example, a first electrically-non-conductive underfill paste (NCP) type is applied to an I/O region of a first die. A second NCP type is applied outside the I/O region of the first die, the second NCP type having more filler than the first NCP type, and the second die is bonded to a first die using the NCP.Type: ApplicationFiled: June 29, 2013Publication date: January 1, 2015Inventors: Hualiang Shi, Shengquan Ou, Sairam Agraharam, Shan Zhong, Sivakumar Nagarajan, Weihua Tang