Abstract: Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 ?m-100 ?m accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.

Abstract: The present invention discloses an automatic identification method and device for planetary seismograph azimuth angles based on a planetary sundial, comprising: obtaining geographical coordinates of a sundial needle tip and a sundial needle tip shadow relative to a planetary surface; determining a theoretical second solar ray elevation angle and a ray azimuth angle; constructing an objective function according to a first solar ray elevation angle and a ray azimuth angle corresponding to a time for obtaining the sundial needle tip shadow; and taking a minimum objective function as a target for solving a planetary seismograph azimuth angle. The present invention determines the planetary seismograph azimuth angle only by optical photos of a planetary rover or a lander without active vibration devices on supporting legs of the lander, thereby reducing system complexity and reducing weight, volume and power consumption brought by additional devices on the supporting legs of the lander.

Abstract: Disclosed is a single star-based orientation method using a dual-axis level sensor, which includes a calibration process and an actual calculation process.

Abstract: The disclosure provides a liquid molding compound and preparation method thereof, belonging to the technical field of semiconductor packaging. The liquid molding compound includes: the following components in mass fraction, a filler 83%-88%, an epoxy resin 6%-9%, a curing agent 6%-9%, a colorant 0.1%-0.2%, an accelerator 0.1%-0.3%, and a paraffin oil 0.3%-0.6%; by adding paraffin oil that has a small surface activity, paraffin oil does not participate in the reaction between epoxy resin and curing agent, is easily compatible with epoxy resin, and easy to precipitate under heating conditions. The precipitated paraffin oil forms a spacer layer between the colloid surface and the thermal release tape. The paraffin oil of the spacer layer has almost no adhesion to the acrylic adhesive on the thermal release tape, so the thermal release tape can be easily removed at a certain temperature to achieve the effect of no residual adhesive.

Abstract: Disclosed is a curling device, which includes a curling component and a handle component, wherein the curling component includes two clamping parts arranged oppositely and a sleeve concentrically sleeved on the clamping parts, wherein the sleeve has a placement groove extending axially, the clamping part comprises a shell with an axial mounting groove, a heating plate component mounted in the mounting groove, and a metal plate fixed to the shell; and wherein two opposite heating plate components provide a perm working surface, and a cooling channel provided between the back surface of the shell and the metal plate is in fluid communication with the handle component, one or more air holes are provided on the metal plate, and the outer peripheral surface of the metal plate has a smooth layer such that a cylindrical and smooth curl cooling surface is formed by two opposite metal plates.

Abstract: Disclosed is a curling device, which includes a curling component and a handle component, wherein the curling component includes two clamping parts arranged oppositely and a sleeve concentrically sleeved on the clamping parts, wherein the sleeve has a placement groove extending axially, the clamping part comprises a shell with an axial mounting groove, a heating plate component mounted in the mounting groove, and a metal plate fixed to the shell; and wherein two opposite heating plate components provide a perm working surface, and a cooling channel provided between the back surface of the shell and the metal plate is in fluid communication with the handle component, one or more air holes are provided on the metal plate, and the outer peripheral surface of the metal plate has a smooth layer such that a cylindrical and smooth curl cooling surface is formed by two opposite metal plates.

Abstract: Disclosed is a hair-straightening comb for quick styling, which includes a comb-tooth part and a handle part, the comb-tooth part includes a housing with an inner cavity, a heat-conducting comb body sealingly embedded in the inner cavity, and a heat-generating component fixed on a back side of the comb body; the comb body includes a bottom plate and short comb teeth formed on an outer surface of the bottom plate, and the bottom plate has a plurality of embedding grooves distributed at intervals, a comb-tooth bar is embedded in the embedding groove; the handle part includes an outer casing, and a fan component and an air inlet provided on the outer casing, an air duct communicating with the outer casing is formed between the housing and the comb body, and air outlet holes communicate with the air duct.

Abstract: The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.

Abstract: The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.

Abstract: The present disclosure discloses an automatic hair curler, which includes a hair curling part and a handle part; the hair curling part includes two splint devices arranged oppositely, and a sleeve concentrically sleeved outside the splint devices, the splint device includes a mounting shell arranged along an axial direction and a heating plate component movably mounted on the inner side of the mounted shell, an elastic member is provided between the mounting shell and the heating plate component so that two sets of opposite heating plate components can be attached to form a hair heating working surface, the sleeve has two oppositely arranged placement grooves distributed along the axial direction; wherein a driving motor for driving the sleeve or the splint devices to rotate around an axis is provided in the handle part.

Abstract: The present invention provides a multifunctional hair straightening and curling device, including: an upper main body, a lower main body and a handle, wherein the upper heating body is disposed on the upper main body, the lower heating body is disposed on the lower main body, one end of the upper heating body and one end of the lower heating body are rotatably connected by a rotary shaft, a button is disposed on the upper main body, the upper surface of the upper main body is provided with first air outlets, the upper main body is provided with a first air outlet passage therein, the lower surface of the lower main body is provided with second air outlets, the lower main body is provided with a second air outlet passage therein, the handle is provided with a fan therein.

Abstract: A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).

Abstract: A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).

Abstract: Disclosed is an electric splint, used for straightening hair and curling hair, which includes two splint parts clamped to each other and hinged to each other at one end, the splint part includes an elongated housing, a heating-plate component mounted on a clamped side of the housing, comb teeth located in a position corresponding to an axial position of the heating-plate component and distributed on an outer surface of the housing, and an air duct located inside the housing; air outlet holes communicating with the air duct are provided at two side edges of the housing corresponding to a distribution area of the comb teeth, and the electric splint further includes a fan component and an air inlet for providing cold air to the air duct.

Abstract: Disclosed is a new type of electric splint structure, which includes two hinged splint parts and a tail end part; the splint part includes a housing and a heating-plate component mounted on the inner side of the housing, an air duct is arranged inside the housing, opposite air outlet holes and bristle-planting comb-teeth are respectively provided on one side edge of the two opposite housings, and the air outlet holes communicate with the air duct and are inclined toward the outside; the tail end part includes a fan component. The air outlet holes inclined toward the outside are provided on the side of the heating-plate component.

Abstract: The present invention discloses a device for evaluating and demagnetizing residual magnetism quantity of a power transformer. A main circuit comprises a switching power supply the two ends of which are respectively connected with a filter capacitor and a resistor in parallel. A forward end of the switching power supply is connected with a main switch in series. A rear end of the main switch is connected with a series branch of a sixth switch and a first resistor, a series branch of a first switch and a second switch, and a series branch of a third switch and a fourth switch are connected in parallel. A driving circuit is respectively connected with driving ends of the main switch, the sixth, first, second, third and fourth switches. A control circuit is connected with the driving circuit for sending an instruction to the driving circuit.

Abstract: Disclosed is a hair-straightening comb for quick styling, which includes a comb-tooth part and a handle part, the comb-tooth part includes a housing with an inner cavity, a heat-conducting comb body sealingly embedded in the inner cavity, and a heat-generating component fixed on a back side of the comb body; the comb body includes a bottom plate and short comb teeth formed on an outer surface of the bottom plate, and the bottom plate has a plurality of embedding grooves distributed at intervals, a comb-tooth bar is embedded in the embedding groove; the handle part includes an outer casing, and a fan component and an air inlet provided on the outer casing, an air duct communicating with the outer casing is formed between the housing and the comb body, and air outlet holes communicate with the air duct.

Abstract: The present disclosure discloses an automatic hair-curling wand, which includes a handle part and a hair-curling part, the hair-curling part includes a heat-conducting body having radially radiating heat-conducting fins, a heat generating component, a heat-conducting tube sleeved on an outer wall of the heat-conducting body, and a bristle-planting strip fixed on the heat-conducting fins, the bristle-planting strip is provided with bristle-planting comb-teeth, and the heat-conducting tube has comb-tooth holes for the bristle-planting comb-teeth to pass through and an air outlet; the handle part includes a housing, a fan assembly and an air inlet are arranged in the housing, and the handle part has an air outlet communicating with a gap space between the adjacent heat-conducting fins, and a driving motor that drives the hair-curling part to rotate around an axis.