Patents by Inventor Shengrong Ye

Shengrong Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THREE-DIMENSIONAL (3D) PRINTING AND INJECTION MOLDING CONDUCTIVE FILAMENTS AND METHODS OF PRODUCING AND USING THE SAME
    Publication number: 20190077072
    Abstract: Three-dimensional (3D) printing and injection molding conductive filaments and methods of producing and using the same are disclosed. According to an aspect, a conductive filament for 3D printing includes a material comprising polymer. The conductive filament also includes anisotropic conductive particles dispersed within the material.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 14, 2019
    Inventors: Benjamin Wiley, Shengrong Ye