Patents by Inventor Shengshan WEN

Shengshan WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLEXIBLE COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR DETACHING FLEXIBLE COVER
    Publication number: 20200411790
    Abstract: A flexible component is provided. The flexible component includes an adherence reduction layer for bonding. As the flexible component includes the adherence reduction layer, it is possible to facilitate bonding of the flexible component and detaching of a flexible cover from the flexible component. Also provided are an electronic device and a method for detaching a flexible cover.
    Type: Application
    Filed: September 14, 2020
    Publication date: December 31, 2020
    Inventors: Shengshan WEN, Kun ZHANG, Wen-Chieh SHIH