Patents by Inventor Shengxian Zhou

Shengxian Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240106140
    Abstract: A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.
    Type: Application
    Filed: August 4, 2023
    Publication date: March 28, 2024
    Applicant: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Qigui Xu, E Zhao, Zhigang Sheng, Shengxian Zhou
  • Patent number: 11757215
    Abstract: A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: September 12, 2023
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Qigui Xu, E Zhao, Zhigang Sheng, Shengxian Zhou
  • Publication number: 20220052467
    Abstract: A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.
    Type: Application
    Filed: March 8, 2021
    Publication date: February 17, 2022
    Applicant: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Qigui Xu, E Zhao, Zhigang Sheng, Shengxian Zhou
  • Patent number: 10944189
    Abstract: A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: March 9, 2021
    Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Qigui Xu, E Zhao, Zhigang Sheng, Shengxian Zhou
  • Publication number: 20200268166
    Abstract: The present disclosure discloses a combination mattress, including a first layer and a second layer which has a smaller rigidity than that of the first layer and is stacked on the first layer, the thickness of the first region in the first layer corresponding to the shoulder of a human body is smaller than that of a second region corresponding to the waist of a human body the overall rigidity of the region corresponding to the shoulders of the human body in the combination mattress is smaller than the overall rigidity of the region corresponding to the waist of the human body.
    Type: Application
    Filed: June 7, 2019
    Publication date: August 27, 2020
    Inventor: Shengxian ZHOU
  • Publication number: 20200099149
    Abstract: A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.
    Type: Application
    Filed: May 17, 2019
    Publication date: March 26, 2020
    Applicant: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Qigui Xu, E Zhao, Zhigang Sheng, Shengxian Zhou
  • Patent number: D931652
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: September 28, 2021
    Assignee: Aukey Technology Co., Ltd
    Inventors: Shengxian Zhou, Qing Wei