Patents by Inventor Shenzhen FU

Shenzhen FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical module
    Patent number: 11927817
    Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: March 12, 2024
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Sigeng Yang, Shenzhen Fu, Xuxia Liu
  • SOLID FORM OF DIAMINOPYRIMIDINE COMPOUND OR HYDRATE THEREOF, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
    Publication number: 20220204475
    Abstract: The present invention relates to a solid form of 5-((2-ethynyl-5-isopropylpyridin-4-yl)oxy)pyrimidine-2,4-diamine or a hydrate thereof, a method for preparing the solid form, a pharmaceutical composition comprising the solid form, and a use of the solid form for the prevention or treatment of a disease modulated by P2X3 and/or P2X2/3 receptor antagonists.
    Type: Application
    Filed: April 29, 2020
    Publication date: June 30, 2022
    Inventors: CheungLing CHENG, Yanping ZHAO, Hongjun WANG, Zewang FENG, Huai HUANG, Kai LIU, Xuelian LIU, Jianmei PANG, Nana TIAN, Xichao CHEN, Shenzhen FU, Jie MENG, Liying ZHOU, Yanan LIU
  • SALT OF DIAMINOPYRIMIDINE COMPOUNDS, AND SOLID FORM THEREOF, PREPARATION METHOD THEREFOR AND USE THEREOF
    Publication number: 20220177447
    Abstract: The present invention relates to a salt of 5-((2-ethynyl-5-isopropylpyridin-4-yl)oxy)pyrimidine-2,4-diamine and a solid form thereof, a method for preparing the solid form and a pharmaceutical composition comprising the solid form, as well as a use of the solid form for preventing or treating diseases modulated by P2X3 and/or P2X2/3 receptor antagonists.
    Type: Application
    Filed: April 29, 2020
    Publication date: June 9, 2022
    Inventors: Yanping ZHAO, Hongjun WANG, Zewang FENG, Huai HUANG, Kai LIU, Xuelian Liu, Jianmei PANG, Nana TIAN, Xichao CHEN, Shenzhen FU, Jie MENG, Liying ZHOU, Yanan LIU
  • OPTICAL MODULE
    Publication number: 20220003944
    Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 6, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Sigeng YANG, Shenzhen FU, Xuxia LIU