Abstract: A plug connector compatible to type-A USB 3.0 standard includes an insulative housing having a supporting portion, and a number of contacts divided into a first contact group and a second contact group on the insulative housing. The first contact group includes a number of first contacts compatible to USB 2.0 standard. The second contact group includes a number of second contacts compatible to USB 3.0 standard together with the first contacts. Each first contact and each second contact includes a flat first soldering section and a flat second soldering section, respectively. The flat first soldering sections and the flat second soldering sections are supported by and exposed on a single side of the supporting portion. As a result, cables can be easily and simultaneously soldered to the first and the second soldering sections for improving assembling efficiency.

Abstract: A cable connector compatible to type-A USB 3.0 standard includes a number of contacts divided into a first contact group and a second contact group. The first contact group is compatible to USB 2.0 standard. The second contact group includes a number of second contacts having a first pair of high-speed differential signal contacts, a second pair of high-speed differential signal contacts and a grounding contact disposed between the first pair and the second pair of high-speed differential signal contacts. The second soldering section of the grounding contact is of a forked manner and includes at least a first branch and a second branch. As a result, it is more effective to solder the second soldering section of the grounding contact with a cable without any manual alignment work.

Abstract: A cable connector compatible to USB 3.0 standard includes an insulative housing having, a number of contacts and an inner circuit board for establishing electrically connection between the contacts and cables. The contacts are divided into a first contact group including a number of first contacts and a second contact group including a number of second contacts. The inner circuit board includes a first soldering area having a number of separated first pads connected to the first and the second contacts. The first pads include a first grounding pad connected to a grounding contact of the second contacts. The second soldering area includes a number of separated second pads connected to the cables. At least two adjacent or separated second pads are electrically connected to the first grounding pad for improving high frequency characteristics.