Patents by Inventor Sheou Hooi Lim

Sheou Hooi Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURABLE TAPE
    Publication number: 20090025882
    Abstract: An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation.
    Type: Application
    Filed: October 7, 2008
    Publication date: January 29, 2009
    Applicant: INTEL CORPORATION
    Inventors: Szu Shing Lim, Sheou Hooi Lim, Yew Wee Cheong
  • Die molding for flip chip molded matrix array package using UV curable tape
    Patent number: 7465368
    Abstract: An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation.
    Type: Grant
    Filed: December 24, 2003
    Date of Patent: December 16, 2008
    Assignee: Intel Corporation
    Inventors: Szu Shing Lim, Sheou Hooi Lim, Yew Wee Cheong