Abstract: A method for plating metallic leads or terminals of integrated circuits having a leaded glass component with a plating composition that avoids dentrite growth, can be soldered, and is corrosion resistant is disclosed. According to the method, the metallic element is electroplated with lead and tin simultaneously. An aqueous plating solution comprising water, sulphate ion, tin, and chelated lead, where the lead is chelated with either ethylene diamine or ethylene diamine gluconate, is formed. The metallic element with a leaded glass portion is placed in the solution and an electrical current is passed through this solution to deposit lead and tin on the metallic element to form a plating comprising at least about 90 percent by weight tin, and at least about 2 percent by weight lead. The plating solution and the plated substrate produced by the method of the present invention are also novel.