Abstract: A nonvolatile memory device is described. The memory device includes a main memory array for storing data. The main memory array comprises a first block and a second block. A redundant memory array comprises a first redundant block and a second redundant block. The first redundant block comprises a first redundant column of memory cells and a second redundant column of memory cells. The second redundant block comprises a third redundant column of memory cells and a fourth redundant column of memory cells. A content addressable memory (CAM) comprises a first set of CAM cells for storing a first address of a first defective column in the main memory array and a second set of CAM cells for storing a second address of a second defective column in the main memory array. The first set of CAM cells cause the first redundant column in the first redundant block to replace the first defective column when the first defective column is in the first block.

Abstract: A nonvolatile memory includes a first block and a second block. The first block comprises a first memory cell and a first source line coupled to a source of the first memory cell. The second block comprises a second memory cell and a second source line coupled to a source of the second memory cell. A first source switch is coupled to the first source line for selectively coupling a first potential, a second potential, and a third potential to the first source line. The second potential has a voltage intermediate between the first potential and the third potential. A second source switch is coupled to the second source line for selectively coupling one of the first, second, and third potentials to the second source line. A block select circuit receives a block address for selecting one of the first and second source switches to couple one of the first, second, and third potentials to its respective one of the first and second source lines.

Abstract: A nonvolatile memory device residing on a substrate is described. The memory device includes a first block and a second block. The first block includes a first sub-block comprising a first memory cell, a first bit line coupled to a drain of the first memory cell, and a first source line coupled to a source of the first memory cell. The first block also includes a second sub-block which includes a second memory cell, a second bit line coupled to a drain of the second memory cell, and a second source line coupled to a source of the second memory cell. The second block comprises a third sub-block comprising a third memory cell, a third bit line coupled to a drain of the third memory cell, and a third source line coupled to a source of the third memory cell. The second block also includes a fourth sub-block which includes a fourth memory cell, a fourth bit line coupled to a drain of the fourth memory cell, and a fourth source line coupled to a source of the fourth memory cell.

Abstract: A memory device includes a memory array and a plurality of output pins. A control input is provided for receiving a control signal. The control signal can be in a first voltage state and a second voltage state. When the control signal is in the first voltage state, the memory device is in a first output mode. When the control signal is in the second voltage state, the memory device is in a second output mode. Circuitry is provided for selectively coupling the plurality of output pins to the memory array. An output mode select logic is coupled to receive the control signal for selecting the first output mode and the second output mode for the memory device. When the memory device is in the first output mode, the output mode select logic controls the circuitry to couple all of the plurality of output pins to the memory array. When the memory device is in the second output mode, the output mode select logic controls the circuitry to couple a portion of the plurality of output pins to the memory array.