Abstract: A single substrate high frequency sonic processing module uses a substrate chamber dimensionally sized to the substrate for immersing the substrate in processing solution. Sonic wave permeable membranes form two ends of the substrate chamber along a sonic wave path therethrough. A sonic wave generated by a transducer external to the substrate chamber, travels through sonic wave conducting liquid in contact with the first membrane, external to the substrate chamber. The liquid is shaped by a sonic wave guide of continuously diminishing cross sectional area along the sonic wave path therethrough, thus intensifying and concentrating the sonic wave entering the substrate chamber. The sonic wave passes through the second membrane to a sonic absorbing and dissipating ante chamber. A method for sonic processing of substrates is disclosed. The individual sonic processing modules are combined into a single system for simultaneously processing plural substrates.

Abstract: A system for the preparation of no-bake foundry sands for preparation of metal casting molds. A settable binder is introduced into the sand and thoroughly and uniformly mixed therewith and then discharged around a pattern. The resulting mold then sets up and hardens rapidly without baking. After use to produce a metal casting, the mold is broken up and the sand recycled for further use. The present system is characterized by ease of feed rate variation, coordinated feeding of components, short residence time, efficient mixing and reduced clean-up problems. It comprises a horizontal axis paddle-type rotary mixer, coordinated means for feeding the mixture components to the mixer housing and discharge of the mixture upon demand including at least one gas assisted injection port or nozzle for the binder system and control means for regulating the rates of flow. The apparatus is desirably movably supported to facilitate distribution of the discharge.