Patents by Inventor Sherry Chi

Sherry Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for polishing semiconductor substrates
    Patent number: 12394628
    Abstract: Methods for polishing semiconductor substrates are disclosed. The methods may involve alternating a first and second polishing slurry during polishing. The first and second slurries each contain silica particles with the silica particles of the first slurry containing more silica than the particles of the second slurry. By alternating between first and second polishing slurries, the polishing method may improve wafer flatness.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: August 19, 2025
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Sherry Chi, HanChung Huang, Patrick Lin
  • METHODS FOR POLISHING SEMICONDUCTOR SUBSTRATES
    Publication number: 20230197455
    Abstract: Methods for polishing semiconductor substrates are disclosed. The methods may involve alternating a first and second polishing slurry during polishing. The first and second slurries each contain silica particles with the silica particles of the first slurry containing more silica than the particles of the second slurry. By alternating between first and second polishing slurries, the polishing method may improve wafer flatness.
    Type: Application
    Filed: October 26, 2022
    Publication date: June 22, 2023
    Inventors: Sherry Chi, HanChung Huang, Patrick Lin