Patents by Inventor Sherry L. F. Helsel

Sherry L. F. Helsel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated method for joining wafers
    Patent number: 5314107
    Abstract: A method for joining a number of first and second wafers (11,12) having one polished surface in preparation for direct wafer bonding is provided. The method involves placing a number of first (11) and the same number of second (12) wafers into slots (16) of a retainer (14) so that each of the polished surfaces of the number of first wafers (11) is forced to contact one of the polished surfaces of the number of second wafers (12).
    Type: Grant
    Filed: December 31, 1992
    Date of Patent: May 24, 1994
    Assignee: Motorola, Inc.
    Inventors: Frank S. d'Aragona, Raymond C. Wells, Sherry L. F. Helsel