Patents by Inventor Sherry Xiaoqi

Sherry Xiaoqi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stack package for high density integrated circuits
    Patent number: 7217994
    Abstract: A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in electrical communication with corresponding contacts on the ASIC and a second, substantially opposite surface including contacts arranged in electrical communication with corresponding contacts on a PCB. The at least one memory chip is dimensioned to fit within a cutout section in the interposer.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: May 15, 2007
    Assignee: Kyocera Wireless Corp.
    Inventors: Sherry Xiaoqi Zhu, Cam T. Nguyen
  • Methods for assembling a stack package for high density integrated circuits
    Patent number: 7151010
    Abstract: Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: December 19, 2006
    Assignee: Kyocera Wireless Corp.
    Inventors: Cam T. Nguyen, Sherry Xiaoqi Zhu
  • Stack package for high density integrated circuits
    Publication number: 20060113653
    Abstract: A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in electrical communication with corresponding contacts on the ASIC and a second, substantially opposite surface including contacts arranged in electrical communication with corresponding contacts on a PCB. The at least one memory chip is dimensioned to fit within a cutout section in the interposer.
    Type: Application
    Filed: December 1, 2004
    Publication date: June 1, 2006
    Inventors: Sherry Xiaoqi, Cam Nguyen