Patents by Inventor Sherwin Moss

Sherwin Moss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vector transient reflow of lead free solder for controlling substrate warpage
    Publication number: 20050001019
    Abstract: A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.
    Type: Application
    Filed: May 7, 2003
    Publication date: January 6, 2005
    Inventors: Lakhi Goenka, Peter Sinkunas, Larry Schmidt, Sherwin Moss