Patents by Inventor Sheue Fen Yong

Sheue Fen Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit Systems And Methods Using Spacer Dies
    Publication number: 20230100829
    Abstract: An integrated circuit package includes a first integrated circuit die, a spacer die coupled in the integrated circuit package in a location designed to house a second integrated circuit die, and a package substrate coupled to the first integrated circuit die and to the spacer die.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 30, 2023
    Applicant: Intel Corporation
    Inventors: Sheue Fen Yong, Archanna Srinivasan, Graham Baker, Pheak Ti Teh