Abstract: Techniques and systems for maintaining a plasma processing kit consisting of protection and shielding elements without causing damage are introduced. The elements may be made of aluminium, polysilicon and quartz and may be coated with silicon. The surfaces of the elemants show a specified roughness. Precision cleaning and recovery of the contamined kit components of a plasma doping (PLAD) system is used, to extend the life and reusability of the components. The methods described cover the stages of inspection, pre-cleaning, mechanical processing and texturing, post-cleaning, clean-room class cleaning and packaging of the components consisting of quartz, aluminium and/or silicon. Techniques described employ the combination of a variety of means (primarily chemical and mechanical) to achieve the desired levels of cleanliness. The result obtained by methods that include Inductively Coupled Plasma-Mass Spectrometry (ICP-MS) and Laser Particle Count affirm the efficacy of these techniques.

Abstract: An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.

Abstract: A method to ensure uniform deposition of organic layer is disclosed. Since the organic layer is very thin, any deviation from the target thickness will result in visible optical defects. A homogenous layer which exhibits good coating behaviour with organic materials is provided beneath the organic layer. By covering the metal interconnects, the adverse effect on the uniformity of the polymer layer is reduced or prevented.

Abstract: A method to ensure uniform deposition of organic layer is disclosed. Since the organic layer is very thin, any deviation from the target thickness will result in visible optical defects. A homogenous layer which exhibits good coating behaviour with organic materials is provided beneath the organic layer. By covering the metal interconnects, the adverse effect on the uniformity of the polymer layer is reduced or prevented.

Abstract: An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.