Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, and a polymer over the die and the molding. The die has a top surface. The molding has a top surface. The polymer has a first bottom surface contact the die and a second surface contacting the molding. The first bottom surface is at a level substantially same as the second bottom surface.

Abstract: A production line for producing components to a high standard of cleanliness and sealed and protected in that state includes a loading device, a cleaning device, a detecting device, a pasting device, a heat-sealing device, a packing device, and transfer devices of the production line. The production line automatically processes the components for obtaining components with the high cleanliness. By the processes of protective film pasting, heat-sealing, and packing, the components may be further protected from subsequent pollution. A method for producing components with a high cleanliness applied to the production line is also disclosed.

Abstract: The present disclosure provides a visual analysis system based on a discipline assessment report, and relates to the technical field of discipline assessment. The visual analysis system based on a discipline assessment report includes a data acquisition unit. An output end of the data acquisition unit is electrically connected to an input end of a data preprocessing unit, and an output end of the data preprocessing unit is electrically connected to an input end of a central processing unit. According to the visual analysis system based on a discipline assessment report, development and changes of the discipline in a project corresponding to the indicator are accurately determined, and a clear plan and development goal are made for overall development of the discipline. Therefore, the overall discipline assessment and a follow-up development process are more clear and distinct.

Abstract: A method of manufacturing a semiconductor structure includes receiving a die comprising a top surface and a sacrificial layer covering the top surface; disposing a molding surrounding the die; removing the sacrificial layer from the die; disposing a polymer over the die and the molding, wherein the polymer has a first bottom surface contacting the die and a second bottom surface contacting the molding, and the first bottom surface is at a level substantially same as the second bottom surface.

Abstract: A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.

Abstract: Provided are antibodies that recognize the B-Cell Maturation Antigen (BCMA) and methods of use thereof.

Abstract: The present invention discloses a recombinant RBD trimer protein capable of simultaneously generating cross neutralization activity for various severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) epidemic strains. The RBD trimer protein is taken as an antigen and supplemented with an adjuvant to immunize an organism, so that a high-titer neutralizing antibody aiming at various SARS-CoV-2 epidemic strains can be generated at the same time, and the antibody has a certain broad-spectrum property and can be used for treating and/or preventing SARS-CoV-2 infection and/or coronavirus disease 2019.

Abstract: An image processing method includes the following steps. Firstly, a block-size value is obtained. Then, a first frame into a plurality of first blocks according to the block-size value is divided. Then, a second frame into a plurality of second blocks according to the block-size value is divided. Then, a noise reduction intensity array is obtained according to a first pixel information of each first block and a second pixel information of each second block. Then, an output frame is obtained according to the noise reduction intensity array, the first frame and the second frame.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.

Abstract: A preparation method of soft carbon comprises heating heavy oil to raw coke under a condition of 480° C.-550° C., heating the raw coke to 850° C.-900° C. at a first heating rate of 3° C./min to 5° C./min and holding the temperature for 4 hours or more to obtain a carbon-containing material, grinding and grading the carbon-containing material to obtain a carbon-containing powder, heating the carbon-containing powder to 1030° C.-1220° C. at a second heating rate of 3° C./min to 10° C./min and holding the temperature for 4 hours or more to obtain a carbon material powder, and adding pitch to the carbon material powder, and then heating it to 1030° C.-1220° C. at a third heating rate of 0.90° C./min to 1.25° C./min and holding the temperature for 5 hours or more to obtain soft carbon.

Abstract: Embodiments of the present disclosure relate to a method, system, and computer program product for translation of rich text. In some embodiments, a method is disclosed. According to the method, one or more candidate formats are determined for source rich text. A target format for the source rich text is selected from the one or more candidate formats based on one or more corresponding images obtained from rendering the source rich text in the one or more candidate formats. Based on the target format, a translation editing environment is provided for editing a translation of the source rich text. In other embodiments, a system and a computer program product are disclosed.

Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Abstract: A method, computer system, and a computer program product for task assistance is provided. The present invention may include acquiring a request expression input by a user. The present invention may include identifying a request intent associated with a task based on the request expression. The present invention may include determining a response script corresponding to the request intent. The present invention may include executing the response script to complete the task and presenting the process of running the task in a user-interface (UI).

Abstract: Passive monitoring the integrity of current sensing devices and associated circuitry in GFCI and AFCI protective devices is provided. A protection circuit interrupter employs a capacitively coupled noise signal obtained by an arrangement of one or both of line side arms relative to a Rogowski coil. The noise signal is monitored while the line and load sides of a protective circuit interrupter are disconnected, and the connection of the line and load sides disabled if the noise signal fails to correlate sufficiently to a reference noise cycle. When the line and load sides are connected, the RMS value of the observed current signal is monitored such that the line and load sides are disconnected if the observed current signal fails to meet an RMS threshold. The observed current signal is compensated by subtracting the reference noise cycle prior to monitoring for the fault condition applicable to the protective device.

Abstract: A composition for forming a release coating comprises (A) an organopolysiloxane having an average of at least two carbinol functional groups per molecule. The organopolysiloxane (A) is present in the composition in an amount of from 50 to 99 wt. % based on the total weight of the composition. The composition further comprises (B) a polyisocyanate. The release coating formed with the composition is not a foam. A release coating formed with the composition is also disclosed. In addition, a method of preparing a coated substrate comprising a release coating disposed on a substrate, as well as the coated substrate formed in accordance with the method, are disclosed.

Abstract: The present disclosure may provide a marking system for intestinal valve imaging. The marking system may obtain multiple intestinal images of an examined object. The marking system may perform intestinal valve segmentation on at least a portion of the multiple intestinal images to determine at least one independent intestinal valve. The marking system may also mark the at least one independent intestinal valve in the at least a portion of the multiple intestinal images.

Abstract: In an embodiment, a device includes: a first integrated circuit die having a first contact region and a first non-contact region; an encapsulant contacting sides of the first integrated circuit die; a dielectric layer contacting the encapsulant and the first integrated circuit die, the dielectric layer having a first portion over the first contact region, a second portion over the first non-contact region, and a third portion over a portion of the encapsulant; and a metallization pattern including: a first conductive via extending through the first portion of the dielectric layer to contact the first integrated circuit die; and a conductive line extending along the second portion and third portion of the dielectric layer, the conductive line having a straight portion along the second portion of the dielectric layer and a first meandering portion along the third portion of the dielectric layer.

Abstract: A method is provided. The method includes: obtaining a picture to be processed, where the picture to be processed includes a plurality of pixels, and the plurality of pixels comprise first pixels for forming an image and second pixels for forming an image background; rotating the picture to be processed, where for each rotation angle, an intermediate picture is obtained; selecting at least two pictures from the picture to be processed and several intermediate pictures for calculating an area of a bounding box surrounding the image respectively; and removing second pixels outside the bounding box in a picture with the smallest area of bounding box to obtain a processed picture.

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.