Patents by Inventor Shi Chen

Shi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136317
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • Patent number: 11965833
    Abstract: A detection device includes a frame, a transport mechanism, detection mechanisms, and a grasping mechanism. The transport mechanism includes a feeding line, a first flow line, and a second flow line arranged in parallel on the frame. The detection mechanisms are arranged on the frame and located on two sides of the transport mechanism. The grasping mechanism is arranged on the frame and used to transport workpieces on the feeding line to the detection mechanisms, transport qualified workpieces to the first flow line, and transport unqualified workpieces to the second flow line.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: April 23, 2024
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jing-Zhi Hou, Lin-Hui Cheng, Yan-Chao Ma, Jin-Cai Zhou, Zi-Long Ma, Neng-Neng Zhang, Yi Chen, Chen-Xi Tang, Meng Lu, Peng Zhou, Ling-Hui Zhang, Lu-Hui Fan, Shi-Gang Xu, Cheng-Yi Chao, Liang-Yi Lu
  • Publication number: 20240128217
    Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.
    Type: Application
    Filed: January 20, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Jung CHEN, Chen Chiang YU, Wei-An TSAO, Tsung-Fu TSAI, Szu-Wei LU, Chung-Shi LIU
  • Patent number: 11961814
    Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Publication number: 20240116655
    Abstract: Disclosed are a system and a method for capturing a space target. The system includes a plurality of capturing devices, a delivery device, a launching device, and a deceleration and recovery device, each of the plurality of capturing devices is configured to be launched into a target orbit to capture a defunct space target, the delivery device is configured to deliver, along a preset delivery trajectory, each of the plurality of capturing devices to a first preset location in the launching device, the launching device is configured to launch each of the plurality of capturing devices located at the first preset location into the target orbit to capture the defunct space target, and the deceleration and recovery device is configured to decelerate each of the plurality of capturing devices after it is launched and flies a preset distance.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Applicant: Harbin Institute of Technology
    Inventors: Jinsheng GUO, Fan WU, Shi QIU, Jian CHEN, Cheng WEI, Hongxu WANG
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240100209
    Abstract: A sterilization and deodorization waste container having dual-wave band ultraviolet lamp tube includes an isolation chamber provided on an inner side of a container lid and a dual-wave band ultraviolet lamp tube installed in the isolation chamber. The dual-wave band ultraviolet lamp tube is capable of simultaneously generating a direct ultraviolet light wave and an ozone ultraviolet light wave. The isolation chamber includes a reflector housing having a light transmitting window facing an inner cavity of a container body. The dual-wave band ultraviolet lamp tube is controlled by a control circuit to turn on to generate the ultraviolets into an inner cavity of the container body while the container lid is closed and to turn off to stop generating the ultraviolet while the container lid is opened.
    Type: Application
    Filed: July 30, 2021
    Publication date: March 28, 2024
    Applicants: Fujian Nashida Electronic Incorporated Company, Nine Stars Group (U.S.A.) Inc.
    Inventors: Shi Ping Wang, Jiangqun Chen, Youxi Lou, Zhou Lin
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11939603
    Abstract: A modified cutinase is disclosed. The cutinase has the modified amino acid sequence of SEQ ID NO: 2, wherein the modification is a substitution of asparagine at position 181 with alanine, or substitutions of asparagine at position 181 with alanine and phenylalanine at position 235 with leucine. The modified enzyme has improved PET-hydrolytic activity, and thus, the high-activity PET hydrolase is obtained, and the industrial application value of the PET hydrolase is enhanced.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: March 26, 2024
    Assignee: HUBEI UNIVERSITY
    Inventors: Chun-Chi Chen, Jian-Wen Huang, Jian Min, Xian Li, Beilei Shi, Panpan Shen, Yu Yang, Yumei Hu, Longhai Dai, Lilan Zhang, Yunyun Yang, Rey-Ting Guo
  • Patent number: 11940498
    Abstract: Passive monitoring the integrity of current sensing devices and associated circuitry in GFCI and AFCI protective devices is provided. A protection circuit interrupter employs a capacitively coupled noise signal obtained by an arrangement of one or both of line side arms relative to a Rogowski coil. The noise signal is monitored while the line and load sides of a protective circuit interrupter are disconnected, and the connection of the line and load sides disabled if the noise signal fails to correlate sufficiently to a reference noise cycle. When the line and load sides are connected, the RMS value of the observed current signal is monitored such that the line and load sides are disconnected if the observed current signal fails to meet an RMS threshold. The observed current signal is compensated by subtracting the reference noise cycle prior to monitoring for the fault condition applicable to the protective device.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: March 26, 2024
    Assignee: Hubbell Incorporated
    Inventors: Gary Michael Miller, William Vernon Miller, Edward Shi Chen
  • Publication number: 20240095467
    Abstract: Translating applications to a target language includes extracting program integrated information (PII) to be translated and creating translation context datasets based on interpretation of accessibility information associated with particular strings of PII. Translation pairs include PII and corresponding context datasets for context-based translation of application components. A two-stage index contains PII strings for first stage lookup and context datasets for distinguishing duplicate PII strings as a second stage lookup. Real-time translation is facilitated by the two-stage index, which is established by translation pairs and resulting translations.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 21, 2024
    Inventors: CHIH-YUAN LIN, Jin Shi, Shu-Chih Chen, PEI-YI LIN, Chao Yuan Huang
  • Publication number: 20240087915
    Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Yen-Hao HUANG, Chun-Yi CHEN, I-Shi WANG, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
  • Publication number: 20240069452
    Abstract: Embodiments of the present disclosure relate to projection stabilization systems and maskless lithography systems having projection stabilization systems. The projection stabilization system compensates for propagating vibrations that move image projection systems (IRS's). The IRS's are in a processing positon prior to operation of the maskless lithography process. One or more stiffeners are coupled to the IPS. The one or more stiffeners apply pressure to flexures coupled to each stiffener. The flexures are coupled to the IPS to provide stabilization to the IPS during the operations of the maskless lithography process. For example, the one or more of stiffeners protect the IPS from vibrations that propagate through the system during operation.
    Type: Application
    Filed: February 1, 2022
    Publication date: February 29, 2024
    Inventors: Assaf KIDRON, Jiawei SHI, Liang-Yuh CHEN, Che-Kai CHANG, Tsu-Hui YANG, Nimrod SMITH, Grant WANG, Preston FUNG, Vasuman Ghanapaati SRIRANGARAJAN, Davidi KALIR, Rudolf C. BRUNNER
  • Publication number: 20240069912
    Abstract: A method for identifying hard-coded strings in source code is disclosed. In one embodiment, such a method parses source code and associated localization resource files to identify hard-coded strings and their associated context. The method provides a confidence score for each hard-coded string that indicates whether the hard-coded string is translatable or non-translatable. Based on the confidence score for each hard-coded string, the method transforms each hard-coded string into a single equivalence word. The method then prepares training data by tagging the hard-coded strings in the source code and associated localization resource files as one of translatable and non-translatable. The method then trains a parts-of-speech (POS) tagging model using the training data. At runtime, the method fetches potential hard-coded strings and tags each hard-coded string as one of translatable and non-translatable using the POS tagging model. A corresponding system and computer program product are also disclosed.
    Type: Application
    Filed: August 27, 2022
    Publication date: February 29, 2024
    Applicant: International Business Machines Corporation
    Inventors: Jin Shi, Chih-Yuan Lin, Shu-Chih Chen, Pei-Yi Lin, Chao Yuan Huang
  • Publication number: 20240026024
    Abstract: Provided is an isolated antigen-binding protein, capable of binding to CD73. The isolated antigen-binding protein contains HCDR3, and the HCDR3 comprises an amino acid sequences as shown in SEQ ID No.:3. Also provided are a preparation method for the antigen-binding protein, and an application of the antigen-binding protein.
    Type: Application
    Filed: December 10, 2021
    Publication date: January 25, 2024
    Inventors: Jingen XU, Xiangyang ZHU, Haijia YU, Xiaoyue WEI, Ling TONG, Shi CHEN
  • Publication number: 20230399409
    Abstract: The present application provides an antibody targeting interleukin 36R, a preparation method therefor, and an application thereof. Specifically, the present application provides an IL-36R antibody having high affinity and high bioactivity. The antibody can bind to IL-36R with high affinity, and can block the binding between an IL-36R ligand (?, ?. ?) and the IL-36R and a signal path activated by the IL-36R ligand, thereby treating and/or preventing IL-36 related diseases.
    Type: Application
    Filed: November 4, 2021
    Publication date: December 14, 2023
    Inventors: Yujie FENG, Haijia YU, Xiaoyue WEI, Guoyuan PENG, Shi CHEN, Lili QU
  • Publication number: 20230383221
    Abstract: A method for making an alcohol-containing food product comprises combining: (a) a first aqueous solution that includes a multivalent salt, one or more liquid alcohol additives and a thickening agent; with (b) a second aqueous solution that includes an alginate bath. The combination uses extrusion machinery to mass produce spherical beads, less than about 20 mm in typical diameter, with a liquid alcohol center encapsulated in a gelled outer shell. The resulting end product should be collected and stored in a third aqueous solution that maintains similar properties to the first aqueous solution and one or more liquid alcohol additives.
    Type: Application
    Filed: March 20, 2023
    Publication date: November 30, 2023
    Inventors: SHIAN-JUNG CHAO, YUN-SHI CHEN
  • Patent number: 11830673
    Abstract: A method of preparing a soft carbon material for high-voltage supercapacitors includes: providing an initial soft carbon material characterized by: (A) a first carbon layer spacing greater than 0.345 nm but less than 0.360 nm; (B) a crystal plane (002) with a length (Lc) less than 6 nm; (C) a crystal plane (101) with a length (La) less than 6 nm; and (D) an intensity ratio (I(002)/I(101)) of the crystal plane (002) to the crystal plane (101) obtained by XRD analysis being less than 60; performing an alkaline activation on the initial soft carbon material with an alkaline activator to obtain a first processing carbon material; and performing an electrochemical activation on the first processing carbon material with an electrolyte to obtain the soft carbon material for the high-voltage supercapacitors.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: November 28, 2023
    Assignee: CPC CORPORATION, TAIWAN
    Inventors: Yan-Shi Chen, Gao-Shee Leu, Yu-Chien Liu, Chi-Chang Hu
  • Publication number: 20230359201
    Abstract: A control method includes in response to a mode switch operation of a user, switching to a first control mode or a second control mode, in response to a position adjustment of an operation member of a control terminal, adjusting a position or an attitude of an aerial vehicle in a control direction corresponding to the operation member, in the first control mode, in response to the operation member being at a preset first initial position, controlling the aerial vehicle to maintain the position or the attitude unchanged in the control direction, and in the second control mode, in response to the aerial vehicle being in an initial status in the control direction and the operation member being in a preset second initial position different from the first initial position, controlling the aerial vehicle to maintain the position or the attitude unchanged in the control direction.
    Type: Application
    Filed: June 26, 2023
    Publication date: November 9, 2023
    Inventors: Chengfu LU, Shi CHEN, Xiaobin YAN, Jun JING