Abstract: A vehicle seat assembly, suitable for vehicles such as locomotives and the like, includes a main cushion body and a lifting cushion. The main cushion body has a sliding cushion connected to a vehicle body with a sliding structure. The lifting cushion is connected to the vehicle body with a linkage mechanism. The lifting cushion is moved into a carriage when the sliding cushion is in a first position, and when the sliding cushion slides laterally into a second position to form a space portion, the lifting cushion can be lifted from the carriage and moved into the space portion and then positioned, or can be lowered into the carriage again, so that the sliding cushion can be moved back to the first position, thereby allowing the user to adjust seat cushion length according to their needs.

Abstract: The present disclosure provides an air duct structure to receive a processing component. The air duct structure includes an air inlet opening, an air outlet opening, a plurality of side walls, and a support surface. The air inlet opening is in direct fluid communication with an air inlet of the computer chassis. The air outlet opening is in direct fluid communication with an air inlet of a processing component. The plurality of side walls at least partially define a channel extending between the air inlet opening and the air outlet opening. The support surface receives the processing component on the air duct structure relative to the computer chassis. The processing component includes an air exhaust to diffuse air, and the plurality of side walls at least partially fluidly isolate the air inlet opening from an air diffused from the air exhaust.

Abstract: A semiconductor device includes a first electrode layer, a ferroelectric layer, a first alignment layer and a second electrode layer. A material of the first alignment layer includes rare-earth metal oxide. The ferroelectric layer and the first alignment layer are disposed between the first electrode layer and the second electrode layer, and the first alignment layer is disposed between the ferroelectric layer and the first electrode layer.

Abstract: Provided are a data processing method and apparatus applied to a target device in which a Linux operating system is running. A first program is deployed in the Linux operating system. The method includes: loading a target loading and invasion machine into a first memory space of the first program, and creating, in the first memory space, a second memory space for the target loading and invasion machine, where the second memory space is simply available to the target loading and invasion machine and to a program loadable by the target loading and invasion machine; configuring a second runtime environment for a second program, where the second runtime environment is isolated from a first runtime environment of the first program; and loading the second program into the second memory space based on the second runtime environment, and running the second program in a threaded manner.

Abstract: The present invention provides an anti-PD-L1/VEGF bispecific antibody and a use thereof. Specifically, the present invention provides a bifunctional antibody, comprising: (a) anti-PD-L1 antibody or element; and (b) an anti-VEGF antibody or element linked to the anti-PD-L1 antibody or element. The bifunctional antibody of the present invention can simultaneously bind to VEGF and PD-L1, thereby exerting a therapeutic effect on VEGF and PD-L1-positive tumor cells (especially malignant tumor cells).

Abstract: Various embodiments of the present application are directed towards an integrated chip (IC). The IC comprises a trench capacitor overlying a substrate. The trench capacitor comprises a plurality of capacitor electrode structures, a plurality of warping reduction structures, and a plurality of capacitor dielectric structures. The plurality of capacitor electrode structures, the plurality of warping reduction structures, and the plurality of capacitor dielectric structures are alternatingly stacked and define a trench segment that extends vertically into the substrate. The plurality of capacitor electrode structures comprise a metal component and a nitrogen component. The plurality of warping reduction structures comprise the metal component, the nitrogen component, and an oxygen component.

Abstract: Embodiments of the present disclosure provide a rotary base, a ranging device, and a mobile robot, which include a mount, a drive assembly, and a processing module. The mount encloses an accommodation portion, wherein an accommodation recess is defined in the accommodation portion. The drive assembly includes a rotor being arranged in the accommodation recess and a rotation portion being connected to the rotor. The processing module is arranged on the mount and connected to the drive assembly, wherein the processing module is configured to detect a commutation signal of the drive assembly to acquire a rotation speed and a rotation angle of the rotation portion.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: A transformable Unmanned Aerial Vehicle (UAV), can operate as a coplanar hexacopter or as an omnidirectional multirotor based on different operation modes. The UAV has 100% force efficiency for launching or landing tasks in the coplanar mode. In the omnidirectional mode, the UAV is fully actuated in the air for agile mobility in six degrees of freedom (DOFs). Models and control design are developed to characterize the motion of the transformable UAV. Simulation results are presented to validate the transformable UAV design and the enhanced UAV performance, compared with a fixed structure.

Abstract: Poly-bit cells and methods for forming the same are provided. In one example, a method for forming a poly-bit cell includes identifying layouts in a library of single-bit cells having one or more of a different functionality and a different drive that are combinable; storing, in memory, layouts that are combinable; and creating layouts of poly-bit cells from the stored combinable single-bit cells. Each poly-bit cell combined from layouts of at least two single-bit cells has one or more of a different functionality and a different drive.

Abstract: A semiconductor package is provided. The semiconductor package includes: semiconductor dies, separated from one another, and including die I/Os at their active sides; and a redistribution structure, disposed at the active sides of the semiconductor dies and connected to the die I/Os, wherein the redistribution structure includes first and second routing layers sequentially arranged along a direction away from the die I/Os, the first routing layer includes a ground plane and first signal lines laterally surrounded by and isolated from the first ground plane, the first signal lines connect to the die I/Os and rout the die I/Os from a central region to a peripheral region of the redistribution structure, the second routing layer includes second signal lines and ground lines, and the second signal lines and the ground lines respectively extend from a location in the peripheral region to another location in the peripheral region through the central region.

Abstract: A PD-L1 antigen binding protein and an application thereof. The antigen binding protein has one or more of the following properties: binding to a PD-L1 protein at an EC50 value of 0.07 ?g/ml or above; blocking binding between the PD-L1 protein and a PD-1 protein; promoting the activation of a T cell; and inhibiting the volume increase of the in vivo tumor. An application of the antigen binding protein in the preparation of a drug for treating tumor.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a substrate comprising first opposing sidewalls defining a first trench and second opposing sidewalls defining a second trench laterally offset from the first trench. A stack of layers comprises a plurality of conductive layers and a plurality of dielectric layers alternatingly stacked with the conductive layers. The stack of layers comprises a first segment in the first trench and a second segment in the second trench. A first lateral distance between the first segment and the second segment aligned with a first surface of the substrate is greater than a second lateral distance between the first segment and the second segment below the first surface of the substrate.

Abstract: Some implementations described herein provide techniques and apparatuses for an integrated circuit device including a trench capacitor structure that has a merged region. A material filling the merged region is different than a material that is included in electrode layers of the trench capacitor structure. Furthermore, the material filling the merged region includes a coefficient of thermal expansion and a modulus of elasticity that, in combination with the architecture of the trench capacitor structure, reduce thermally induced stresses and/or strains within the integrated circuit device relative to another integrated circuit device having a trench capacitor structure including a merged region and electrode layers of a same material.

Abstract: A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.

Abstract: A shortening composition, including: a base shortening and a flavor enhancing composition. The flavor enhancing composition is prepared by hydrolyzing tallow in the presence of an enzyme.

Abstract: A heating device includes a resonant circuit, a detection unit and a control unit. The resonant circuit includes an inverter circuit and a resonant tank. The inverter circuit provides a resonant tank current and a resonant tank voltage. The resonant tank includes a heating coil, a resonant tank capacitor, a resonant tank equivalent inductor and a resonant tank equivalent resistor. The detection unit calculates an inductance of the resonant tank equivalent inductor according to a capacitance of the resonant tank capacitor, a resonant period and a first expression. The detection unit calculates a resistance of the resonant tank equivalent resistor according to the inductance of the resonant tank equivalent inductor, a time change value, a reference voltage value, a negative peak voltage value and a second expression.