Patents by Inventor Shi Chen
Shi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136317Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
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Patent number: 11965833Abstract: A detection device includes a frame, a transport mechanism, detection mechanisms, and a grasping mechanism. The transport mechanism includes a feeding line, a first flow line, and a second flow line arranged in parallel on the frame. The detection mechanisms are arranged on the frame and located on two sides of the transport mechanism. The grasping mechanism is arranged on the frame and used to transport workpieces on the feeding line to the detection mechanisms, transport qualified workpieces to the first flow line, and transport unqualified workpieces to the second flow line.Type: GrantFiled: November 26, 2020Date of Patent: April 23, 2024Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Jing-Zhi Hou, Lin-Hui Cheng, Yan-Chao Ma, Jin-Cai Zhou, Zi-Long Ma, Neng-Neng Zhang, Yi Chen, Chen-Xi Tang, Meng Lu, Peng Zhou, Ling-Hui Zhang, Lu-Hui Fan, Shi-Gang Xu, Cheng-Yi Chao, Liang-Yi Lu
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Publication number: 20240128217Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.Type: ApplicationFiled: January 20, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Jung CHEN, Chen Chiang YU, Wei-An TSAO, Tsung-Fu TSAI, Szu-Wei LU, Chung-Shi LIU
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Patent number: 11961814Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.Type: GrantFiled: January 31, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu
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Package structure comprising buffer layer for reducing thermal stress and method of forming the same
Patent number: 11961777Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.Type: GrantFiled: June 27, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao -
Publication number: 20240116655Abstract: Disclosed are a system and a method for capturing a space target. The system includes a plurality of capturing devices, a delivery device, a launching device, and a deceleration and recovery device, each of the plurality of capturing devices is configured to be launched into a target orbit to capture a defunct space target, the delivery device is configured to deliver, along a preset delivery trajectory, each of the plurality of capturing devices to a first preset location in the launching device, the launching device is configured to launch each of the plurality of capturing devices located at the first preset location into the target orbit to capture the defunct space target, and the deceleration and recovery device is configured to decelerate each of the plurality of capturing devices after it is launched and flies a preset distance.Type: ApplicationFiled: December 20, 2023Publication date: April 11, 2024Applicant: Harbin Institute of TechnologyInventors: Jinsheng GUO, Fan WU, Shi QIU, Jian CHEN, Cheng WEI, Hongxu WANG
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Patent number: 11955460Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.Type: GrantFiled: October 5, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
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Publication number: 20240100209Abstract: A sterilization and deodorization waste container having dual-wave band ultraviolet lamp tube includes an isolation chamber provided on an inner side of a container lid and a dual-wave band ultraviolet lamp tube installed in the isolation chamber. The dual-wave band ultraviolet lamp tube is capable of simultaneously generating a direct ultraviolet light wave and an ozone ultraviolet light wave. The isolation chamber includes a reflector housing having a light transmitting window facing an inner cavity of a container body. The dual-wave band ultraviolet lamp tube is controlled by a control circuit to turn on to generate the ultraviolets into an inner cavity of the container body while the container lid is closed and to turn off to stop generating the ultraviolet while the container lid is opened.Type: ApplicationFiled: July 30, 2021Publication date: March 28, 2024Applicants: Fujian Nashida Electronic Incorporated Company, Nine Stars Group (U.S.A.) Inc.Inventors: Shi Ping Wang, Jiangqun Chen, Youxi Lou, Zhou Lin
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Patent number: 11942464Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.Type: GrantFiled: July 19, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
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Patent number: 11939603Abstract: A modified cutinase is disclosed. The cutinase has the modified amino acid sequence of SEQ ID NO: 2, wherein the modification is a substitution of asparagine at position 181 with alanine, or substitutions of asparagine at position 181 with alanine and phenylalanine at position 235 with leucine. The modified enzyme has improved PET-hydrolytic activity, and thus, the high-activity PET hydrolase is obtained, and the industrial application value of the PET hydrolase is enhanced.Type: GrantFiled: June 21, 2023Date of Patent: March 26, 2024Assignee: HUBEI UNIVERSITYInventors: Chun-Chi Chen, Jian-Wen Huang, Jian Min, Xian Li, Beilei Shi, Panpan Shen, Yu Yang, Yumei Hu, Longhai Dai, Lilan Zhang, Yunyun Yang, Rey-Ting Guo
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Patent number: 11940498Abstract: Passive monitoring the integrity of current sensing devices and associated circuitry in GFCI and AFCI protective devices is provided. A protection circuit interrupter employs a capacitively coupled noise signal obtained by an arrangement of one or both of line side arms relative to a Rogowski coil. The noise signal is monitored while the line and load sides of a protective circuit interrupter are disconnected, and the connection of the line and load sides disabled if the noise signal fails to correlate sufficiently to a reference noise cycle. When the line and load sides are connected, the RMS value of the observed current signal is monitored such that the line and load sides are disconnected if the observed current signal fails to meet an RMS threshold. The observed current signal is compensated by subtracting the reference noise cycle prior to monitoring for the fault condition applicable to the protective device.Type: GrantFiled: April 28, 2023Date of Patent: March 26, 2024Assignee: Hubbell IncorporatedInventors: Gary Michael Miller, William Vernon Miller, Edward Shi Chen
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Publication number: 20240095467Abstract: Translating applications to a target language includes extracting program integrated information (PII) to be translated and creating translation context datasets based on interpretation of accessibility information associated with particular strings of PII. Translation pairs include PII and corresponding context datasets for context-based translation of application components. A two-stage index contains PII strings for first stage lookup and context datasets for distinguishing duplicate PII strings as a second stage lookup. Real-time translation is facilitated by the two-stage index, which is established by translation pairs and resulting translations.Type: ApplicationFiled: September 16, 2022Publication date: March 21, 2024Inventors: CHIH-YUAN LIN, Jin Shi, Shu-Chih Chen, PEI-YI LIN, Chao Yuan Huang
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Publication number: 20240087915Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Yen-Hao HUANG, Chun-Yi CHEN, I-Shi WANG, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
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Publication number: 20240069452Abstract: Embodiments of the present disclosure relate to projection stabilization systems and maskless lithography systems having projection stabilization systems. The projection stabilization system compensates for propagating vibrations that move image projection systems (IRS's). The IRS's are in a processing positon prior to operation of the maskless lithography process. One or more stiffeners are coupled to the IPS. The one or more stiffeners apply pressure to flexures coupled to each stiffener. The flexures are coupled to the IPS to provide stabilization to the IPS during the operations of the maskless lithography process. For example, the one or more of stiffeners protect the IPS from vibrations that propagate through the system during operation.Type: ApplicationFiled: February 1, 2022Publication date: February 29, 2024Inventors: Assaf KIDRON, Jiawei SHI, Liang-Yuh CHEN, Che-Kai CHANG, Tsu-Hui YANG, Nimrod SMITH, Grant WANG, Preston FUNG, Vasuman Ghanapaati SRIRANGARAJAN, Davidi KALIR, Rudolf C. BRUNNER
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Publication number: 20240069912Abstract: A method for identifying hard-coded strings in source code is disclosed. In one embodiment, such a method parses source code and associated localization resource files to identify hard-coded strings and their associated context. The method provides a confidence score for each hard-coded string that indicates whether the hard-coded string is translatable or non-translatable. Based on the confidence score for each hard-coded string, the method transforms each hard-coded string into a single equivalence word. The method then prepares training data by tagging the hard-coded strings in the source code and associated localization resource files as one of translatable and non-translatable. The method then trains a parts-of-speech (POS) tagging model using the training data. At runtime, the method fetches potential hard-coded strings and tags each hard-coded string as one of translatable and non-translatable using the POS tagging model. A corresponding system and computer program product are also disclosed.Type: ApplicationFiled: August 27, 2022Publication date: February 29, 2024Applicant: International Business Machines CorporationInventors: Jin Shi, Chih-Yuan Lin, Shu-Chih Chen, Pei-Yi Lin, Chao Yuan Huang
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Publication number: 20240026024Abstract: Provided is an isolated antigen-binding protein, capable of binding to CD73. The isolated antigen-binding protein contains HCDR3, and the HCDR3 comprises an amino acid sequences as shown in SEQ ID No.:3. Also provided are a preparation method for the antigen-binding protein, and an application of the antigen-binding protein.Type: ApplicationFiled: December 10, 2021Publication date: January 25, 2024Inventors: Jingen XU, Xiangyang ZHU, Haijia YU, Xiaoyue WEI, Ling TONG, Shi CHEN
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Publication number: 20230399409Abstract: The present application provides an antibody targeting interleukin 36R, a preparation method therefor, and an application thereof. Specifically, the present application provides an IL-36R antibody having high affinity and high bioactivity. The antibody can bind to IL-36R with high affinity, and can block the binding between an IL-36R ligand (?, ?. ?) and the IL-36R and a signal path activated by the IL-36R ligand, thereby treating and/or preventing IL-36 related diseases.Type: ApplicationFiled: November 4, 2021Publication date: December 14, 2023Inventors: Yujie FENG, Haijia YU, Xiaoyue WEI, Guoyuan PENG, Shi CHEN, Lili QU
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Publication number: 20230383221Abstract: A method for making an alcohol-containing food product comprises combining: (a) a first aqueous solution that includes a multivalent salt, one or more liquid alcohol additives and a thickening agent; with (b) a second aqueous solution that includes an alginate bath. The combination uses extrusion machinery to mass produce spherical beads, less than about 20 mm in typical diameter, with a liquid alcohol center encapsulated in a gelled outer shell. The resulting end product should be collected and stored in a third aqueous solution that maintains similar properties to the first aqueous solution and one or more liquid alcohol additives.Type: ApplicationFiled: March 20, 2023Publication date: November 30, 2023Inventors: SHIAN-JUNG CHAO, YUN-SHI CHEN
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Patent number: 11830673Abstract: A method of preparing a soft carbon material for high-voltage supercapacitors includes: providing an initial soft carbon material characterized by: (A) a first carbon layer spacing greater than 0.345 nm but less than 0.360 nm; (B) a crystal plane (002) with a length (Lc) less than 6 nm; (C) a crystal plane (101) with a length (La) less than 6 nm; and (D) an intensity ratio (I(002)/I(101)) of the crystal plane (002) to the crystal plane (101) obtained by XRD analysis being less than 60; performing an alkaline activation on the initial soft carbon material with an alkaline activator to obtain a first processing carbon material; and performing an electrochemical activation on the first processing carbon material with an electrolyte to obtain the soft carbon material for the high-voltage supercapacitors.Type: GrantFiled: August 10, 2020Date of Patent: November 28, 2023Assignee: CPC CORPORATION, TAIWANInventors: Yan-Shi Chen, Gao-Shee Leu, Yu-Chien Liu, Chi-Chang Hu
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Publication number: 20230359201Abstract: A control method includes in response to a mode switch operation of a user, switching to a first control mode or a second control mode, in response to a position adjustment of an operation member of a control terminal, adjusting a position or an attitude of an aerial vehicle in a control direction corresponding to the operation member, in the first control mode, in response to the operation member being at a preset first initial position, controlling the aerial vehicle to maintain the position or the attitude unchanged in the control direction, and in the second control mode, in response to the aerial vehicle being in an initial status in the control direction and the operation member being in a preset second initial position different from the first initial position, controlling the aerial vehicle to maintain the position or the attitude unchanged in the control direction.Type: ApplicationFiled: June 26, 2023Publication date: November 9, 2023Inventors: Chengfu LU, Shi CHEN, Xiaobin YAN, Jun JING