Patents by Inventor Shi-Chi CHEN

Shi-Chi CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR TRANSPORTING WAFERS
    Publication number: 20220285190
    Abstract: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.
    Type: Application
    Filed: May 19, 2022
    Publication date: September 8, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih CHEN, Shi-Chi CHEN, Ting-Wei WANG, Jen-Ti WANG, Kuo-Fong CHUANG
  • Wafer transport system and method for transporting wafers
    Patent number: 11348817
    Abstract: A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: May 31, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih Chen, Shi-Chi Chen, Ting-Wei Wang, Jen-Ti Wang, Kuo-Fong Chuang
  • WAFER TRANSPORT SYSTEM AND METHOD FOR TRANSPORTING WAFERS
    Publication number: 20200176294
    Abstract: A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.
    Type: Application
    Filed: November 14, 2019
    Publication date: June 4, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih CHEN, Shi-Chi CHEN, Ting-Wei WANG, Jen-Ti WANG, Kuo-Fong CHUANG