Abstract: Semiconductor structures and the manufacturing method thereof are disclosed. An exemplary semiconductor structure according to the present disclosure includes a first base portion and a second base portion, an isolation feature sandwiched between the first base portion and the second base portion, a center dielectric fin over the isolation feature, a first anti-punch-through (APT) feature over the first base portion, a second APT feature over the second base portion, a first stack of channel members over the first APT feature, and a second stack of channel members over the second APT feature. The center dielectric fin is sandwiched between the first stack of channel members and the second stack of channel members as well as between the first APT feature and the second APT feature.

Abstract: Semiconductor structures and the manufacturing method thereof are disclosed. An exemplary semiconductor structure according to the present disclosure includes a substrate having a p-type well or an n-type well, a first base portion over the p-type well, a second base portion over the n-type well, a first plurality of channel members over the first base portion, a second plurality of channel members over the second base portion, an isolation feature disposed between the first base portion and the second base portion, and a deep isolation structure in the substrate disposed below the isolation feature.

Abstract: A plurality of single-induction-loops are inserted in an electromagnetic induction system in which multi-induction-loop is deployed. Deployment of a multi-induction-loop layout is constituted by induction loops with sawtooth-shaped areas and close-like areas formed by -type sections of same and opposite phases for reducing the number of switch in use, completely deploying induction loops of X axis and Y axis on a same common contact, effectively reducing area demand of electromagnetic induction system, and thus increasing effective area of panel board in use. Moreover, in order to further enhance ability of interference immunity of electromagnetic induction system, a plurality of single-induction-loops are inserted around multi-induction-loop for isolating interference of noise to multi-induction-loop and thus relatively increasing linearity and efficiency of electromagnetic induction system.

Abstract: A plurality of single-induction-loops are inserted in an electromagnetic induction system in which multi-induction-loop is deployed. Deployment of a multi-induction-loop layout is constituted by induction loops with sawtooth-shaped areas and close-like areas formed by Π-type sections of same and opposite phases for reducing the number of switch in use, completely deploying induction loops of X axis and Y axis on a same common contact, effectively reducing area demand of electromagnetic induction system, and thus increasing effective area of panel board in use. Moreover, in order to further enhance ability of interference immunity of electromagnetic induction system, a plurality of single-induction-loops are inserted around multi-induction-loop for isolating interference of noise to multi-induction-loop and thus relatively increasing linearity and efficiency of electromagnetic induction system.