Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

Abstract: A device for reducing the dark lines on a light scattering guide plate according to the present invention comprises a light scattering guide plate and at least one vein is disposed on a part of the surface of the light incident side thereof. At least one light tube is installed at the outer end of light incident side of the guide plate and a reflecting cover used to cover the light tubes is installed at the light incident side of the guide plate. Therefore, a beam can be scattered or converged to cause the dark lines around the light incident side to be shrunk or weakened effectively to enhance the light uniformity of the entire guide plate.

Abstract: The invention provides a creative latex based mainly vinyl acetate and one of methyl methacrylate, ethyl methacrylate or methyl acrylate, for non-hazardous use in shoe-making. A rigid liner can be made from said latex by any conventional technique wherein a base cloth such as a non-woven fabric is impregnated with said latex, and then the liner can be cut into shoe counter, toe and respective parts of shoe in any appropriate shape, characterized in that wherein said cut and shaped rigid liner is softened with alcohol and thereby produce adhesion, and then, the liner is inserted between the vamp and lining of the toe puff, counter and respective part of a shoe, bonds intimately and sets into fixed shape. Usage of the latex according to the invention in the shoe-making process can avoid serious hazard caused by the conventional latex that must use toluene as the solvent for softening.