Patents by Inventor Shi-How Hua

Shi-How Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package structure
    Patent number: 7528414
    Abstract: A light emitting diode (LED) package structure is disclosed. The LED package structure comprises a lead frame which has a chip carrier part, a pair of extended parts, a first electrode and a second electrode. The chip carrier part has an arc frame, a bulge, a first surface and a second surface. The extended part has a first side, a second side, a first top and a first bottom. The first side connects the arc frame of the chip carrier part. The arc frame electrically connects the first electrode. A heat dissipating material is placed on the second surface.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: May 5, 2009
    Assignee: Industrial Technology Reseach Institute
    Inventors: Tien-Fu Huang, Chin-Yin Yu, Kuo-Chang Hu, Shyh-Rong Tzan, Shi-How Hua
  • LIGHT EMITTING DIODE PACKAGE STRUCTURE
    Publication number: 20080079019
    Abstract: A light emitting diode (LED) package structure is disclosed. The LED package structure comprises a lead frame which has a chip carrier part, a pair of extended parts, a first electrode and a second electrode. The chip carrier part has an arc frame, a bulge, a first surface and a second surface. The extended part has a first side, a second side, a first top and a first bottom. The first side connects the arc frame of the chip carrier part. The arc frame electrically connects the first electrode. A heat dissipating material is placed on the second surface.
    Type: Application
    Filed: February 8, 2007
    Publication date: April 3, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tien-Fu Huang, Chin-Yin Yu, Kuo-Chang Hu, Shyh-Rong Tzan, Shi-How Hua