Patents by Inventor Shi Kong Lin

Shi Kong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250060799
    Abstract: The disclosure relates to an industrial personal computer comprising: a main housing at least one panel of which is used as a CPU heat dissipating member, a portion of the one panel being recessed to form a pocket; a CPU, heat generated by the CPU being transferred to the CPU heat dissipating member and then dissipated directly into the ambient air; a SSD at least partially positioned in the pocket; and a SSD heat dissipating member positioned in the pocket and exposed to the ambient air, heat generated by the SSD being transferred to the SSD heat dissipating member and then dissipated directly into the ambient air, wherein the SSD heat dissipating member is heat isolated from the CPU heat dissipating member.
    Type: Application
    Filed: December 21, 2021
    Publication date: February 20, 2025
    Applicant: Siemens Aktiengesellschaft
    Inventors: Shi Kong Lin, Ting Li Lan
  • Patent number: D1006012
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: November 28, 2023
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Zhan Bo Ren, Andreas Morlock, Xue Kang Li, Shi Kong Lin, Ting Li Lan
  • Patent number: D1024056
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Ting Lai, Shi Kong Lin, Xue Kang Li
  • Patent number: D1024057
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Ting Lai, Shi Kong Lin, Xue Kang Li
  • Patent number: D1024071
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Ting Lai, Shi Kong Lin, Xue Kang Li
  • Patent number: D1024072
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Ting Lai, Shi Kong Lin, Xue Kang Li
  • Patent number: D1025048
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 30, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Zhan Bo Ren, Andreas Morlock, Xue Kang Li, Shi Kong Lin, Ting Li Lan, Yong Jie Sun
  • Patent number: D1025049
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 30, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Zhan Bo Ren, Andreas Morlock, Xue Kang Li, Shi Kong Lin, Ting Li Lan, Yong Jie Sun
  • Patent number: D1046842
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: October 15, 2024
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Shi Kong Lin, Xue Kang Li, Ting Lai