Patents by Inventor Shi-Min Zhou

Shi-Min Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package and method for fabricating the same
    Patent number: 11380978
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: July 5, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Kuo-Hua Yu, Chang-Fu Lin
  • Electronic package
    Patent number: 11289794
    Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: March 29, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Rung-Jeng Lin, Han-Hung Chen, Shi-Min Zhou, Kuo-Hua Yu, Chang-Fu Lin
  • ELECTRONIC PACKAGE
    Publication number: 20210203057
    Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.
    Type: Application
    Filed: April 27, 2020
    Publication date: July 1, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Rung-Jeng Lin, Han-Hung Chen, Shi-Min Zhou, Kuo-Hua Yu, Chang-Fu Lin
  • ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20190123424
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.
    Type: Application
    Filed: April 24, 2018
    Publication date: April 25, 2019
    Inventors: Shi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Kuo-Hua Yu, Chang-Fu Lin