Patents by Inventor Shi-Shyan James Shang

Shi-Shyan James Shang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8058567
    Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: November 15, 2011
    Assignee: Nan Ya PCB Corp.
    Inventors: Meng-Han Lee, Wei-Wen Lan, Ching-Ming Chuang, Shi-Shyan James Shang
  • Publication number: 20090283315
    Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).
    Type: Application
    Filed: July 17, 2008
    Publication date: November 19, 2009
    Applicant: NAN YA PCB CORP.
    Inventors: Meng-Han Lee, Wei-Wen Lan, Ching-Ming Chuang, Shi-Shyan James Shang
  • Patent number: 7572533
    Abstract: A flat panel direct methanol fuel cell (DMFC) includes an integrated cathode electrode sheet; a membrane electrode assembly (MEA) unit; an intermediate bonding layer; an integrated anode electrode sheet; and a fuel container. The fabrication of the integrated cathode/anode electrode sheets is compatible with printed circuit board (PCB) processes.
    Type: Grant
    Filed: April 15, 2007
    Date of Patent: August 11, 2009
    Assignees: Nan Ya Printed Circuit Board Corporation, Antig Technology Co., Ltd.
    Inventors: Yung-Yi Liu, Shi-Shyan James Shang, Hsi-Ming Shu, Tsang-Ming Chang, Feng-Yi Deng
  • Publication number: 20070184968
    Abstract: A flat panel direct methanol fuel cell (DMFC) includes an integrated cathode electrode sheet; a membrane electrode assembly (MEA) unit; an intermediate bonding layer; an integrated anode electrode sheet; and a fuel container. The fabrication of the integrated cathode/anode electrode sheets is compatible with printed circuit board (PCB) processes.
    Type: Application
    Filed: April 15, 2007
    Publication date: August 9, 2007
    Inventors: Yung-Yi LIU, Shi-Shyan James SHANG, Hsi-Ming SHU, Tsang-Ming CHANG, Feng-Yi DENG
  • Patent number: 7220507
    Abstract: A flat panel DMFC (direct methanol fuel cell) includes an integrated cathode electrode sheet; a membrane electrode assembly (MBA) unit; an intermediate bonding layer; an integrated anode electrode sheet; and a fuel container. The integrated cathode/anode electrode sheets are manufactured by using printed circuit board (PCB) compatible processes.
    Type: Grant
    Filed: June 6, 2004
    Date of Patent: May 22, 2007
    Assignee: Antig Technology Co., Ltd.
    Inventors: Yung-Yi Liu, Shi-Shyan James Shang, Hsi-Ming Shu, Tsang-Ming Chang, Feng-Yi Deng
  • Publication number: 20050214621
    Abstract: A novel flat panel DMFC (direct methanol fuel cell) includes an integrated cathode electrode sheet; a membrane electrode assembly (MEA) unit; an intermediate bonding layer; an integrated anode electrode sheet; and a fuel container. The integrated cathode/anode electrode sheets are manufactured by using PCB compatible processes.
    Type: Application
    Filed: June 6, 2004
    Publication date: September 29, 2005
    Inventors: Yung-Yi LIU, Shi-Shyan James SHANG, Hsi-Ming SHU, Tsang-Ming CHANG, Feng-Yi DENG