Patents by Inventor Shi Teng

Shi Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Publication number: 20240063017
    Abstract: The invention provides a photoresist coating method, which comprises the following steps: providing a wafer with a pattern on the wafer, placing the wafer on a spinner, injecting a photoresist on a central region of the wafer from a nozzle, and carrying out a spin coating step, the spin coating step comprises: turning on the spinner to rotate the spinner to a first rotation speed, and raising the first rotation speed to a second rotation speed, and performing a plurality of brakes during the process of maintaining the second rotation speed, so that the second rotation speed instantly drops to a third rotation speed, and then rises to the second rotation speed again.
    Type: Application
    Filed: September 19, 2022
    Publication date: February 22, 2024
    Applicant: United Semiconductor (Xiamen) Co., Ltd.
    Inventors: Shi Teng Zhong, Ching-Shu Lo, Yuan-Chi Pai, WEN YI TAN
  • Publication number: 20120096083
    Abstract: In the field of media transmission technologies, a method and an apparatus for transmitting Hypertext Transfer Protocol (HTTP) media are provided, which solve a problem that a specific capability mode to be used cannot be determined when both a server and a client have enhanced functions. In the method and system for transmitting the HTTP media, the respective information of HTTP streaming media capabilities supported by the server and by the client are obtained. According to the obtained information of the HTTP streaming media capabilities supported by the server and supported by the client, the HTTP streaming media capability used by the server or the client in a subsequent media transmission procedure is determined. The server provides media services according to the determined HTTP streaming media capability; or the client obtains the media services according to the determined HTTP streaming media capability.
    Type: Application
    Filed: December 29, 2011
    Publication date: April 19, 2012
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Shi Teng, Yuanyuan Zhang, Peiyu Yue, Weizhong Yuan, Guangyuan Liu, Renzhou Zhang, Yonghui Tian, Chuxiong Zhang
  • Patent number: 6660593
    Abstract: A method for fabricating oxide layers with different thicknesses on a substrate is described. A field oxide layer is formed on the substrate to define a first active region and a second active region therebetween. A first oxide layer is formed over the first active region. A thin oxynitride layer is formed on the first oxide layer.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: December 9, 2003
    Assignee: Winbond Electronics Corp.
    Inventors: Shing-Sing Chiang, Kuo-Shi Teng, Hao-Chieh Yung, Yi-Shi Chen
  • Publication number: 20020081798
    Abstract: A method for fabricating oxide layers with different thicknesses on a substrate is described. A field oxide layer is formed on the substrate to define a first active region and a second active region therebetween. A first oxide layer is formed over the first active region. A thin oxynitride layer is formed on the first oxide layer.
    Type: Application
    Filed: December 21, 2000
    Publication date: June 27, 2002
    Inventors: Shing-Sing Chiang, Kuo-Shi Teng, Hao-Chieh Yung, Yi-Shi Chen
  • Patent number: 6034439
    Abstract: A method for preventing bonding pads from peeling caused by plug process comprises the following steps. First, a substrate is prepared, and then a first conductor is formed on the substrate. Next, a dielectric layer is formed on the first conductor. After that, a big contact window and a plurality of small contact windows are formed on the dielectric layer, wherein the plurality of small contact windows are located around the big window, and the sizes of the big contact window and small contact windows are over 3 .mu.m. Subsequently, a metal plug layer is formed on the dielectric layer, big contact window and small contact windows. Thereafter, the metal plug layer is etched back to form metal spacers on the sidewalls of the big contact window and small contact windows. Finally, a second conductor is formed on the dielectric layer, big contact window, small contact windows and metal spacers.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: March 7, 2000
    Assignee: Winbond Electronics Corporation
    Inventors: Kuo-Shi Teng, Hao-Chieh Yung, Shing-Shing Chiang, Wen-Haw Lu