Patents by Inventor Shi Wen Zhou

Shi Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8579016
    Abstract: An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8579019
    Abstract: An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8579017
    Abstract: An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8430153
    Abstract: A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: April 30, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8365810
    Abstract: A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: February 5, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8347951
    Abstract: A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: January 8, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8341842
    Abstract: A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: January 1, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Peng Liu, Shi-Wen Zhou, Chun-Chi Chen
  • Publication number: 20120275848
    Abstract: An exemplary connector includes a main body and a block engaged with the main body. The main body includes a central plate, a first extension plate extending downwardly from a lateral side of the central plate, and a second extension plate extending upwardly from an opposite lateral side of the central plate. Two riveting holes are defined through the central plate. The block includes a first securing plate and a second securing plate extending from the first securing plate and attached to the central plate of the main body. Two pins extend from the second securing plate and are punched to be engagingly received in the rivet holes of the central plate to engage with the main body.
    Type: Application
    Filed: August 3, 2011
    Publication date: November 1, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Patent number: 8296947
    Abstract: A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: October 30, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Peng Liu, Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8251132
    Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: August 28, 2012
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jun Cao, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8245765
    Abstract: A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a center of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a center of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: August 21, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Lt., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8220527
    Abstract: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: July 17, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Peng Liu, Shi-Wen Zhou, Chun-Chi Chen, Yi-Jiun Li
  • Patent number: 8061411
    Abstract: A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: November 22, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8047266
    Abstract: A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: November 1, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Jun Cao, Wei-Ping Gong
  • Patent number: 8004843
    Abstract: A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: August 23, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., FoxConn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen
  • Patent number: 7990719
    Abstract: A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: August 2, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 7990720
    Abstract: An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: August 2, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 7983043
    Abstract: A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: July 19, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Guo Chen, Shi-Wen Zhou
  • Patent number: 7967059
    Abstract: A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: June 28, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Jiun Li, Shi-Wen Zhou, Chun-Chi Chen
  • Publication number: 20110094711
    Abstract: An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
    Type: Application
    Filed: January 15, 2010
    Publication date: April 28, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN