Abstract: A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.

Abstract: A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.

Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing the heat sink, an operating member pivotably connected to the first locking member, a second locking member extending the heat sink and the circuit board and pivotably connected to the operating member, and an actuating structure formed between the first and second locking members. The first and second locking members each includes a hook located below the circuit board. The operating member is pivotable about the first locking member to drive the second locking member to move upwardly and to cause the actuating structure to simultaneously drive the first and second locking members to move away from each other, whereby the hooks engage below the circuit board.

Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.

Abstract: An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).

Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

Abstract: A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.

Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

Abstract: A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.

Abstract: A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.

Abstract: A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.

Abstract: A heat sink includes a base and a plurality of spaced parallel fins arranged on the base. Adjacent fins define a plurality of passages there between. Each passage includes an inlet and at least one outlet. The base and the fins made separately, and the fins is thin, such that amount of the fins arranged on the base increases. And the fins are disposed on the base alternately or/and staggered such that the inlet and the outlet are wider than a middle part of the passage to lower airflow resistance thereat. Thus, the heat sink has large heat dissipating area and low airflow resistance synchronously.

Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing the heat sink, an operating member pivotably connected to the first locking member, a second locking member extending the heat sink and the circuit board and pivotably connected to the operating member, and an actuating structure formed between the first and second locking members. The first and second locking members each includes a hook located below the circuit board. The operating member is pivotable about the first locking member to drive the second locking member to move upwardly and to cause the actuating structure to simultaneously drive the first and second locking members to move away from each other, whereby the hooks engage below the circuit board.

Abstract: A heat sink assembly includes a fan (10), a heat sink (20) and a mounting device (50). The heat sink includes a base (22) and plural of fins (24) extending upwardly from the base. Plural of claws (26) are formed in a top end of one fin which extends from a side of the base. A locking hole (30) is defined in another fin which extends from an opposite side of the base. A vent (52) is defined in the center of the mounting device, and four fixing holes (54) are defined in four comers of the mounting device for engaging with four screws (14) which extend through the fan to the mounting device. Plural of pivots (56) are provided in a first side of the mounting device for pivotably received in the claws of the heat sink thereby pivotably attaching the mounting device to the heat sink. A hook (62) is provided in an opposite side of the mounting device for engaging with the locking hole of the heat sink thereby fixing the mounting device to the heat sink.

Abstract: A fastener for a heat sink of the present invention includes a length-variable operating member (10), a piston member (20), an embracing member (30), a resilient member (40) and a post (58) extending from a printed circuit board (50). The piston member is movable in the operating member when the operating member varies between a shortest length and a longest length. The resilient member covers around the piston member. The embracing member is controllable cooperatively by the piston member and the resilient member to grasp the post or release the post.

Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of fasteners extending upwardly beyond the circuit board, and a plurality of retainers. Each retainer includes an operating member resting on a heat sink, a locking member extending through the operating member, and a pushing member extending through the locking member. The locking member includes a locking structure extending through the heat sink to engage with one of the fasteners. The pushing member includes a taper bottom portion. The pushing member is downward movable to cause the taper bottom portion to disengage the locking structure from the one of the fasteners.

Abstract: A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.

Abstract: A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.

Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a liquid inlet port (18) in communication with the container, and a diversion member (20, 20?) located in the casing, for leading liquid from the liquid inlet port to a bottom of the container.

Abstract: A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.