Patents by Inventor Shi-Wen Zhuo

Shi-Wen Zhuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating device
    Publication number: 20060104036
    Abstract: A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
    Type: Application
    Filed: May 23, 2005
    Publication date: May 18, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhuo, Meng Fu, Chi Liang