Abstract: A module has electronic components mounted to a Printed Circuit Board (PCB) with multiple patterned conductive layers connecting to conductive slot metal around a conductive slot. A groove is cut through a top molding encapsulant above and into the conductive slot but does not cut through a bottom molding encapsulant. A terminal pin is inserted into the groove and pushed down into the conductive slot. When heated, embedded solder previously applied to the conductive slot metal flows between the end of the terminal pin and the conductive slot metal to form a solder bond. An end of the PCB past the conductive slot has no metal traces, preventing shorts. Epoxy can be placed into the groove around the terminal pin or a hole formed in the terminal pin to increase strength of the anchored terminal pin. The molding around the groove protects terminal pins from shorting from the side.

Abstract: A module has electronic components mounted to a Printed Circuit Board (PCB) with multiple patterned conductive layers connecting to conductive slot metal around a conductive slot. A groove is cut through a top molding encapsulant above and into the conductive slot but does not cut through a bottom molding encapsulant. A terminal pin is inserted into the groove and pushed down into the conductive slot. When heated, embedded solder previously applied to the conductive slot metal flows between the end of the terminal pin and the conductive slot metal to form a solder bond. An end of the PCB past the conductive slot has no metal traces, preventing shorts. Epoxy can be placed into the groove around the terminal pin or a hole formed in the terminal pin to increase strength of the anchored terminal pin. The molding around the groove protects terminal pins from shorting from the side.

Abstract: A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.

Abstract: A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.

Abstract: A tire pressure monitoring sensor moveable inside a tire includes a housing holding a pressure sensing/transmitting unit, one or more batteries and an antenna for transmitting a signal indicating interior tire pressure. In one embodiment, the components are assembled within the housing such that the center of gravity is along a housing geometric center. During tire rotation, the monitor independently rotates within the tire and is particularly useful for slow-rotating tires, such as those used in gantry systems. Alternatively, the pressure monitoring sensor components are assembled within the housing such that the center of gravity is offset from a housing geometric center. Centripetal force generated during tire rotation causes the monitor to rotate with the tire itself and is useful for faster-rotating tires, such as motor vehicle tires. A tire pressure monitoring system includes the monitor and a receiver positioned outside the tire for receiving the monitoring signals.

Abstract: A tire pressure monitoring sensor moveable inside a tire includes a housing holding a pressure sensing/transmitting unit, one or more batteries and an antenna for transmitting a signal indicating interior tire pressure. In one embodiment, the components are assembled within the housing such that the center of gravity is along a housing geometric center. During tire rotation, the monitor independently rotates within the tire and is particularly useful for slow-rotating tires, such as those used in gantry systems. Alternatively, the pressure monitoring sensor components are assembled within the housing such that the center of gravity is offset from a housing geometric center. Centripetal force generated during tire rotation causes the monitor to rotate with the tire itself and is useful for faster-rotating tires, such as motor vehicle tires. A tire pressure monitoring system includes the monitor and a receiver positioned outside the tire for receiving the monitoring signals.