Patents by Inventor Shi Yuan Lian

Shi Yuan Lian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cover plate used in electronic device, electronic device, and method of manufacturing cover plate
    Patent number: 11647645
    Abstract: A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: May 9, 2023
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Chun Yan Wu, Lien-Hsin Lee, Shi Yuan Lian, Xian Bin Xu, Ming Qiang Fu, Ming Hsien Ko
  • Electronic device
    Patent number: 11494011
    Abstract: An electronic device includes a substrate, a polarizer, a flexible printed circuit board, a first transparent glue layer, a first colloid, and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizer is disposed on the first side of the substrate. The flexible printed circuit board is connected to the first side of the substrate with a conductive glue. A gap is formed between flexible circuit board and polarizer. The first transparent glue layer is disposed on the second side of substrate. The first colloid is configured to bond at least two of substrate, polarizer, or flexible printed circuit board. The second colloid is configured to bond at least two of the substrate, the flexible printed circuit board, or the first transparent glue layer. The first colloid is not in contact with the second colloid.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: November 8, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Xian Bin Xu, Ming Qiang Fu, Shi Yuan Lian, Yong Hui Huang, Xiong Min Zhang, Chen Hsin Chang
  • COVER PLATE USED IN ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING COVER PLATE
    Publication number: 20220223816
    Abstract: A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 14, 2022
    Inventors: Chun Yan Wu, Lien-Hsin Lee, Shi Yuan Lian, Xian Bin Xu, Ming Qiang Fu, Ming Hsien Ko
  • ELECTRONIC DEVICE
    Publication number: 20220221948
    Abstract: An electronic device includes a substrate, a polarizer, a flexible printed circuit board, a first transparent glue layer, a first colloid, and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizer is disposed on the first side of the substrate. The flexible printed circuit board is connected to the first side of the substrate with a conductive glue. A gap is formed between flexible circuit board and polarizer. The first transparent glue layer is disposed on the second side of substrate. The first colloid is configured to bond at least two of substrate, polarizer, or flexible printed circuit board. The second colloid is configured to bond at least two of the substrate, the flexible printed circuit board, or the first transparent glue layer. The first colloid is not in contact with the second colloid.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 14, 2022
    Inventors: Xian Bin Xu, Ming Qiang Fu, Shi Yuan Lian, Yong Hui Huang, Xiong Min Zhang, Chen Hsin Chang