Abstract: An optical measuring device includes a case, a reflective layer and a light collecting lens module. A measuring chamber and a channel, which is connected to the measuring chamber and is connected to an opening of the case, reside in the case. The reflective layer is disposed onto an inner surface of the measuring chamber. The light collecting lens module is located inside the channel. A light beam emits into the channel of the optical measuring device through an opening, passes through the light collecting lens module and enters the measuring chamber afterward.

Abstract: A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

Abstract: The present invention relates to a smart lock structure and an operating method thereof. The smart lock structure comprises a key hole for access keys, an interrogating device for using radio frequency technology to communicate with a mobile device and accept access requests from the mobile device to unlock the smart key structure, and a lock mechanism in response to interaction between the key hole and the access keys and communication between the interrogating device and the mobile device for unlocking the smart lock structure and gaining access thereof. The smart lock structure further comprises a falling proof device equipped beside the interrogating device to prevent falling of the mobile device. An operating method is also provided for normal operation and/or configuration of the smart lock structure.

Abstract: A method for bonding an LED wafer, a method for manufacturing an LED chip, and a bonding structure are provided. The method for bonding an LED wafer includes the following steps. A first metal film is formed on an LED wafer. A second metal film is formed on a substrate. A bonding material layer whose melting point is lower than or equal to about 110° C. is formed on the surface of the first metal film. The LED wafer is placed on the substrate. The bonding material layer is heated at a pre-solid reaction temperature for a pre-solid time to perform a pre-solid reaction. The bonding material layer is heated at a diffusion reaction temperature for a diffusing time to perform a diffusion reaction, wherein the melting points of the first and the second inter-metallic layers after diffusion reaction are higher than about 110° C.

Abstract: The disclosure relates to a solar heating device comprising at least one incidence collector and a thermal container. The thermal container includes at least one light absorbing recess, wherein at least one of the incidence collectors focuses solar beams on a focal point, which is located inside the light absorbing recess. The inner surface of the light absorbing recess converts the energy of the solar beams into radiant heating.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: An LED includes a first intermetallic layer, a first metal thin film layer, an LED chip, a substrate, a second metal thin film layer, and a second intermetallic layer. The first metal thin film layer is located on the first intermetallic layer. The LED chip is located on the first metal thin film layer. The second metal thin film layer is located on the substrate. The second intermetallic layer is located on the second metal thin film layer, and the first intermetallic layer is located on the second intermetallic layer. Materials of the first and the second metal thin film layer are selected from a group consisting of Au, Ag, Cu, and Ni. Materials of the intermetallic layers are selected from a group consisting of a Cu—In—Sn intermetallics, an Ni—In—Sn intermetallics, an Ni—Bi intermetallics, an Au—In intermetallics, an Ag—In intermetallics, an Ag—Sn intermetallics, and an Au—Bi intermetallics.

Abstract: A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid -solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time for performing a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110° C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200° C.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

Abstract: A lightweight, spill resistant, impact resistant and shatter resistant solar cell packaging structure practical for use in a portable product is disclosed to include a top covering layer and a bottom covering layer respectively molded from a thermoplastic polymer, and a solar cell layer formed of an array of solar cell chips and laminated in between the top covering layer and the bottom covering layer.

Abstract: A perpendicular magnetic recording medium includes a substrate, an antiferromagnetic layer disposed above the substrate, and a perpendicular magnetic recording layer formed on the antiferromagnetic layer and exchange-coupled to the antiferromagnetic layer.

Abstract: A real-time alarm system comprises an image capturing element, a network transmission system, a control processing unit and a mobile device. The image capturing element is installed on different sites to generate image information. The image information is transmitted through the network transmission system with one end linking to the image capturing element. The control processing unit is linked to the network transmission system and includes a server, and contains preset information to compare with the image information to generate comparison information. The comparison information is analyzed by a preset algorithm to judge behaviors of objects in the images. The mobile device is linked to the control processing unit to receive the image information. After the control processing unit judges specific behaviors, it actively informs the mobile device to record a video for a selected duration to be seen anytime at a remote site.

Abstract: A multi-stack package light emitting diode (LED) includes an LED chip, a first fluorescent powder layer, a first optical bandpass filter layer and a second fluorescent powder layer. The LED chip generates an LED light. The first fluorescent powder layer and the second fluorescent powder layer respectively have a first fluorescent powder and a second fluorescent powder. The first fluorescent powder and the second fluorescent powder are excited by the LED light to respectively generate a first excitation light and a second excitation light. The first optical bandpass filter layer allows the LED light and the first excitation light to pass and reflects the second excitation light. A wavelength of the LED light is shorter than a wavelength of the second excitation light. The wavelength of the second excitation light is shorter than a wavelength of the first excitation light. Therefore, the multi-stack package LED improves a light emission efficiency.

Abstract: A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid-solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time, so as to perform a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110° C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200° C.

Abstract: A method of manufacturing a light emitting diode (LED) package includes disposing at least one LED chip on a first surface of a lead frame, and the LED chip is connected to the lead frame. At least one heat dissipation area corresponding to the LED chip is defined on a second surface of the lead frame. A thermal conductive material is disposed in the heat dissipation area. The thermal conductive material directly comes into contact with the lead frame. A solidification process is performed to solidify the thermal conductive material and form a plurality of heat dissipation blocks. The heat dissipation blocks directly come into contact with the lead frame, and the solidification process is performed at a temperature substantially lower than 300° C.

Abstract: A diffraction grating recording medium including a waveguide layer and a grating structure layer is provided. The waveguide layer has a reflective surface and a light incident surface, in which a thickness of the waveguide layer is between 100 nanometers and 2 micrometers, and the reflective surface reflects a light that enters the waveguide layer from the light incident layer. The grating structure layer is disposed on the light incident surface of the waveguide layer, in which the grating structure layer has a plurality of diffractive elements, and the arranging period of the diffractive elements is between 50 nanometers and 900 nanometers.

Abstract: The present invention coherent multiple-stage optical rectification terahertz wave generator discloses the generation of single-cycle terahertz radiation with two-stage optical rectification in GaSe crystals. By adjusting the time delay between the pump pulses employed to excite the two stages, the terahertz radiation from the second GaSe crystal can constructively superpose with the seeding terahertz field from the first stage. The high mutual coherence between the two terahertz radiation fields is ensured with the coherent optical rectification process and can be further used to synthesize a desired spectral profile of output coherent THz radiation. The technique is also useful for generating high amplitude single-cycle terahertz pulses, not limited by the pulse walk-off effect from group velocity mismatch in the nonlinear optical crystal used.

Abstract: A perpendicular magnetic recording medium includes a substrate, an antiferromagnetic layer disposed above the substrate, and a perpendicular magnetic recording layer formed on the antiferromagnetic layer and exchange-coupled to the antiferromagnetic layer.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.