Patents by Inventor Shiann Liou

Shiann Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8848313
    Abstract: A system including a printed circuit board having a plurality of vias, a first integrated circuit mounted on a first surface of the printed circuit board, and a casing mounted on a second surface of the printed circuit board. The first surface of the printed circuit board is opposite to the second surface of the printed circuit board. Each of the plurality of vias has (i) a first end extending to the first surface of the printed circuit board and (ii) a second end extending to the second surface of the printed circuit board. The first integrated circuit is in thermal contact with the first ends of the plurality of vias. The casing is in thermal contact with the second ends of the plurality of vias.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: September 30, 2014
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Shiann Liou
  • Patent number: 8355221
    Abstract: A drive system including: a printed circuit board; a first integrated circuit mounted onto the printed circuit board; a drive assembly case that is connected to the printed circuit board; and a first thermal interface material thermally coupled between i) the printed circuit board and ii) the drive assembly case. Thermal energy generated by the first integrated circuit is dissipatable by the drive assembly case through the first interface material.
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: January 15, 2013
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Shiann Liou
  • Patent number: 8218261
    Abstract: A drive system including: a printed circuit board; a first integrated circuit mounted onto the printed circuit board; a drive assembly case that is connected to the printed circuit board; and a first thermal interface material thermally coupled between i) the printed circuit board and ii) the drive assembly case. Thermal energy generated by the first integrated circuit is dissipatable by the drive assembly case through the first interface material.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: July 10, 2012
    Assignee: Marvell International Ltd.
    Inventors: Chenglin Liu, Shiann Liou